Epoxy adhesive DM-6063
for metaltwo-componentfor bonding

Epoxy adhesive - DM-6063 - Shenzhen DeepMaterial Technologies Co., Ltd - for metal / two-component / for bonding
Epoxy adhesive - DM-6063 - Shenzhen DeepMaterial Technologies Co., Ltd - for metal / two-component / for bonding
Epoxy adhesive - DM-6063 - Shenzhen DeepMaterial Technologies Co., Ltd - for metal / two-component / for bonding - image - 2
Epoxy adhesive - DM-6063 - Shenzhen DeepMaterial Technologies Co., Ltd - for metal / two-component / for bonding - image - 3
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal
Number of components
two-component
Applications
for bonding, for electronics, sealing
Technical characteristics
impact-resistant
Working temperature

Min.: -40 °C
(-40 °F)

Max.: 150 °C
(302 °F)

Shear strength

6.8 N

Description

DeepMaterial provides a comprehensive range of one-component and two-component epoxy and acrylic structural adhesives, suitable for structural bonding, sealing and protection operations. DeepMaterial's full range of structural adhesive products have high adhesion, good fluidity, low odor, high definition clarity, high bonding strength and excellent stickiness. Regardless of curing speed or high temperature resistance, DeepMaterial's full range of structural adhesive products have excellent performance, which can fully meet customers' electronic assembly needs. Epoxy Resin Adhesive Has the highest strength and performance High temperature resistance, solvent resistance and aging resistance are the best ·Rigid bonding Fill the gap and seal ·Small to medium area bonding Suitable for cleaning surfaces Rigid Bonding Tough adhesive can withstand high-load connection applications and is used to replace mechanical connections. The use of this adhesive to connect two workpieces is structural bonding. Simplifying the connection structure can increase strength and toughness. It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.