DeepMaterial provides a comprehensive range of one-component and two-component epoxy and acrylic structural adhesives, suitable for structural bonding, sealing and protection operations. DeepMaterial's full range of structural adhesive products have high adhesion, good fluidity, low odor, high definition clarity, high bonding strength and excellent stickiness. Regardless of curing speed or high temperature resistance, DeepMaterial's full range of structural adhesive products have excellent performance, which can fully meet customers' electronic assembly needs.
Epoxy Resin Adhesive
Has the highest strength and performance
High temperature resistance, solvent resistance and aging resistance are the best ·Rigid bonding
Fill the gap and seal ·Small to medium area bonding
Suitable for cleaning surfaces
Rigid Bonding
Tough adhesive can withstand high-load connection applications and is used to replace mechanical connections. The use of this adhesive to connect two workpieces is structural bonding.
Simplifying the connection structure can increase strength and toughness.
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.