Simulation software Simcenter Flotherm

thermal analysisdevelopmentdigital twin

Overview
Simcenter Flotherm is an electronics cooling simulation solution for thermal analysis supporting the development of a thermal digital twin. It shortens development at IC package, PCB and enclosure level through to large systems such as datacenters, and integrates into electronics development workflows to provide thermal engineering feedback from early-stage architecture to final verification.

Key benefits

• Accelerate electronics thermal design workflow: integrates with engineering workflows to provide timely, accurate results and feedback across disciplines to reduce development time and risk.
• Accurate, fast thermal analysis: structured Cartesian gridding and solver technology designed to handle large, complex electronics models (thousands of components, wide range of length scales).
• SmartPart modeling and libraries: rapid model creation using intelligent SmartParts for electronics-specific components (heatsinks, fans, heat pipes, enclosures, etc.).
• EDA & MCAD interoperability: support for major EDA data formats (including ODB++), an EDA Bridge for streamlined processing, and CAD import/pre-processing for increasing model fidelity as design matures.
• Compact thermal modeling and optimization: compact models (2R, DELPHI) and parametric analysis/optimization capabilities for design space exploration and fast verification.

Capabilities — highlights

• Transient thermal analysis: supports transient events down to sub-microsecond time scales; models time-dependent power dissipation, thermostatic control behaviors, power cycles, fan control, power derating and transient mitigation strategies.
• Robust meshing: instantaneous, reliable structured-Cartesian meshing tailored for electronics; localized grid controls and SmartPart-associated gridding eliminate re-gridding when geometry is repositioned or re-oriented.
• BCI-ROM technology: Boundary Condition Independent Reduced Order Models for fast transient thermal simulation while preserving accuracy; BCI-ROMs exported as matrices (for Matlab/Simulink), VHDL-AMS, or FMU for system-level or circuit-level electrothermal analysis.
• Pack utility and compact models: utilities for creating mono-chip IC package detailed thermal models and generating 2R/DELPHI compact thermal models; additional SmartPart and ECXML enhancements and component libraries (including ROHM semiconductor components).

Workflow & integration
Simcenter Flotherm supports progressive increase of model complexity and fidelity during development: early-stage pre-CAD exploration, ECAD-driven board modeling with routing and component layout, MCAD integration for enclosure and system-level studies, and exportable compact or reduced-order models for use in circuit and system simulators.

Typical application areas

• IC package and module thermal characterization
• PCB-level thermal analysis and optimization
• Enclosure and system cooling (including datacenter-scale studies)
• Power electronics transient and power-cycle analysis
• Electrothermal co-simulation via FMU or VHDL-AMS

Caractéristiques / spécifications techniques

• Product type: Software — On-premises
• Vendor / brand: Siemens
• Designed for: electronics cooling CFD, thermal digital twin development
• Meshing: structured Cartesian, object-associated SmartPart gridding, localized grid controls
• EDA support: imports and processing for major EDA formats including ODB++; EDA Bridge for fidelity control
• Compact models: 2R, DELPHI compact thermal models; parametric and optimization tools
• BCI-ROM: boundary-condition independent reduced-order models; export formats include matrix (Matlab/Simulink), VHDL-AMS, FMU
• Transient support: sub-microsecond capability; transient power profiles, thermostatic control, fan control, derating studies
• Assets & libraries: SmartParts libraries (heatsinks, fans, heat pipes, enclosures, ROHM components, etc.)
• Typical domains: IC packages, PCBs, enclosures, datacenters, power electronics
• Release / maintenance info present on page: content updated/modified (metadata indicates modified-date 2026-05-05)