PCB design software suite Valor NPI
design optimizationprocessfor PCB

PCB design software suite - Valor NPI - Siemens PLM Software - design optimization / process / for PCB
PCB design software suite - Valor NPI - Siemens PLM Software - design optimization / process / for PCB
PCB design software suite - Valor NPI - Siemens PLM Software - design optimization / process / for PCB - image - 2
PCB design software suite - Valor NPI - Siemens PLM Software - design optimization / process / for PCB - image - 3
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Characteristics

Function
design optimization, PCB design
Applications
process, for PCB

Description

Overview
Valor NPI is a DFM (Design for Manufacturing) software integrated into the PCB design flow that detects manufacturability, assembly and test issues early — from library cell validation through incremental layout stages — to accelerate new product introduction and optimize yield and cost.

Key capabilities
  • Manufacturing Driven Design (MDD): automatically applies supplier‑specific DFM profiles and process knowledge within the design environment so designers can optimize for manufacturability during layout.
  • Comprehensive DFM checks: extensive rule sets covering PCB fabrication, assembly and test across technologies (FR4, rigid‑flex, flex, packaging substrates).
  • Component risk assessment: evaluates assembly and failure risk per component using the Valor Parts Library to provide BOM‑level risk summaries and prioritization.
  • DFM profile collaboration: reference supplier manufacturing capabilities and digital twins (via PCBflow) to validate designs against specific vendor constraints.
  • Assembly panel design and optimization: generate and analyze assembly arrays with breakaway tabs, fiducials and tooling holes, and run DFM analysis at the array/panel level.
  • Integrated parts and footprint awareness: validate component spacing, solder joints and alternate parts with a parts‑aware library to reflect real assembly constraints.

Benefits
  • Detect and fix manufacturing issues earlier in the design flow to reduce rework, shorten ramp‑to‑volume and lower production costs.
  • Improve yield and field reliability by addressing fabrication and assembly risks before production.
  • Align designs to supplier capabilities to avoid unexpected manufacturing delays and additional costs.

Technical specifications
  • Supported board technologies: FR4, rigid‑flex, flex, packaging substrates.
  • MDD support to apply manufacturing process knowledge automatically in the design flow.
  • Extensive DFM rule set for fabrication, assembly and test; library cell validation and incremental layout checks.
  • Component risk assessment based on the Valor Parts Library for BOM‑level risk analysis.
  • Integration/collaboration with PCBflow for supplier DFM profiles and digital‑twin capability exchange.
  • Assembly array and panel creation and DFM analysis with support for breakaway tabs, fiducials and tooling holes.

Catalogs

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Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2026
Intersolar 2026

23-25 Jun 2026 Munich (Germany) Hall B2 - Stand 539

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