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Simulation software suite Innovator3D IC
designdata managementmodeling

Simulation software suite - Innovator3D IC - Siemens PLM Software - design / data management / modeling
Simulation software suite - Innovator3D IC - Siemens PLM Software - design / data management / modeling
Simulation software suite - Innovator3D IC - Siemens PLM Software - design / data management / modeling - image - 2
Simulation software suite - Innovator3D IC - Siemens PLM Software - design / data management / modeling - image - 3
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Characteristics

Function
planning, analysis, protocol analysis, simulation, thermal simulation, design, modeling, prototyping, data management, digital twin
Applications
process
Type
3D

Description

Product overview
  • Innovator3D IC is an integrated 3D digital‑twin design suite for system‑level planning, prototyping and predictive analysis of 2.5D/3D heterogeneous semiconductor assemblies. It unifies planning, physical layout, protocol compliance and data governance across multi‑die assemblies, interposers and advanced substrates.


Key capabilities
  • System‑level planning and prototyping via a hierarchical 3D digital‑twin cockpit representing the complete device assembly.
  • Predictive PPA (power, performance, area, cost) analysis before physical implementation to reduce iterations and time‑to‑market.
  • Integrated multi‑physics and 3D EM analysis (thermal, electrical, mechanical) for early validation.
  • Standards and vendor‑model compliance checks including UCIe protocol and IBIS‑AMI channel simulation.
  • Centralized WIP data hub with automatic extraction, secure version control and instant project access.
  • Modular components supporting planning, layout, protocol analysis and data management (Integrator, Layout, Protocol Analyzer, Data Management).


AI‑infused user experience
  • Natural language queries across design data for instant cross‑domain results.
  • AI assistant that highlights potential issues, filters false positives and suggests classifications or fixes.
  • Intelligent search to locate related elements across projects and one‑click approve or modify AI suggestions.
  • The system learns from user interactions and provides proactive recommendations tuned to workflows.


True 3D digital twin and analysis
  • Complete 3D digital‑twin "blueprint" enabling visualization and interaction with all interconnect levels in a single environment.
  • Pre‑route and pre‑implementation multi‑physics and 3D EM analyses to assess thermal, electrical and mechanical characteristics.
  • Seamless integration with third‑party analysis tools (e.g., Calibre, HyperLynx, Simcenter) for predictive verification.


Compliance, protocol and IP management
  • Automated pre‑route predictive analysis for UCIe and other interconnect compliance needs.
  • Vendor‑model IBIS‑AMI simulation for channel and link analysis with configurable speed, modulation, encoding and metric reporting.
  • Centralized data hub to maintain secure version control of source IP and project artifacts with automated extraction at check‑in.


Awards & recognition
  • 3DInCites – Technology Enablement (2025)
  • Chiplet Summit – Best of Show (2026)


Technical specifications
  • Product family: Innovator3D IC (Integrator, Layout, Protocol Analyzer, Data Management)
  • Target use: 2.5D/3D heterogeneous integration, System‑in‑Package (SiP), interposers and advanced substrates
  • Data model: Hierarchical 3D digital‑twin representation
  • Analysis types: Multi‑physics (thermal, electrical), 3D EM, pre‑route predictive analysis, PPA optimization
  • Compliance: UCIe checks; IBIS‑AMI vendor‑model simulation
  • Tool integrations: Flow‑level integration with CAE/EDA engines (Calibre, HyperLynx, Simcenter)
  • Collaboration & data management: Centralized WIP hub, automatic extraction at check‑in, secure version control
  • AI features: Natural language search, AI assistant for issue filtering and recommendations
  • Typical workflows: System‑level planning, prototyping, predictive analysis, verification
  • Intended benefits: Reduce iterations, accelerate time‑to‑market, predict and mitigate thermal/electrical issues pre‑silicon

Catalogs

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Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2026
Intersolar 2026

23-25 Jun 2026 Munich (Germany) Hall B2 - Stand 539

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