BGA rework station
EA-H15

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BGA rework station BGA rework station - EA-H15
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Characteristics

  • Applications:

    for BGA

Description

Specifications:

General Power
1600W(max)
Power of top heater
720W(120W*6, infrared heating tube, wavelength about 2-8μm)
Power of bottom heater (hot air)
1600W(400W*4, dark infrared heater)
2000W(500W*4, high infrared heating tube, optional)
Top heating range
20-60mm(X, Y adjustable)
Bottom heating range
290*290mm
Max PCB size
400*400mm
Communication
USB(be connected with PC)
Temperature sensor
Non-contact infrared sensor
Weight
55kg
Dimension
850(L)mm*650(W)mm*730(H)mm
PL

Camera
22*10 times magnifying; 12V/300mA; Horizontal resolution 480 lines; PAL format
Prism size
50mm*50mm
BGA size range
2*2-60*60(mm)
Video output signal
Video signal
RPC
22*10 times magnifying
Horizontal resolution: 480 lines
PAL format