CVD deposition machine

thin-filmhigh-precisiononline

Overview
Oxide deposition system using CBVD for processing 2 to 18-inch wafers. Designed to perform controlled oxide layer growth with real-time monitoring and fully automated operation. Compatible with wafers up to Ø450 mm.

Range
Sybilla machine range.

Key features

• CBVD technology developed with our partner 3D Oxides
• Uniform deposition across wafers up to Ø450 mm
• Real-time monitoring to maintain optimal growth conditions
• Fully automated process
• Designed for 2 to 18-inch wafers
• Imaging and product visualization available (photographs of the Sybilla range)

Documentation
Technical documentation available (PDF specific to the Oxides machine).

Technical specifications

• Technology: CBVD (Chemical Beam Vapor Deposition)
• Technical partner: 3D Oxides
• Compatible wafer range: 2 to 18 inches
• Target uniformity: up to Ø450 mm
• Control: real-time monitoring of growth parameters
• Automation: fully automated process
• Range: Sybilla
• Reference year: 2026 (range development)