Lead-free printed circuit board

metal coremultilayerfor electronics

Turnkey PCBA solutions for weaving machinery deliver one‑stop printed circuit board assembly and module integration engineered for textile industry conditions (high vibration, dust, continuous operation). Backed by 20+ years of EMS experience, the offering covers PCB design and reverse engineering, precision SMT/THT assembly and full box builds for automation of weaving lines.

Services / Turnkey offering

• PCB Design & Reverse Engineering: replication, optimization and upgrade of legacy boards; Gerber/Altium/ODB++ workflow support.
• PCBA Manufacturing: advanced SMT, THT and mixed‑technology lines for fine‑pitch BGA, QFN and ultra‑small passives.
• Box Build & Final Assembly: complete integration including cabling, enclosures and electromechanical assembly delivering ready‑to‑use modules.
• Testing & Validation: AOI, X‑ray for BGA, ICT and functional testing (FCT) as standard.

Additional benefits

• Fast prototype-to-production lead times
• Quality assurance to IPC‑A‑610 Class 2 & Class 3 and ISO 9001
• Conformal coating and potting options for dust/humidity protection
• Technical support for industrial drive and control applications

Applications

• Electronic Dobby and Jacquard controllers
• Weft feeders and tension control systems
• Warp‑stop modules and safety interlocks
• Main control units for air‑jet and water‑jet looms

Technical features / specifications

• PCB Layers: 1–24 layers (HDI supported)
• Base Materials: High TG FR4 (TG170+), CEM‑3, Aluminum (metal core)
• Board Thickness: 0.4 mm – 3.2 mm (standard 1.6 mm)
• Copper Weight: 1 oz – 6 oz (heavy copper available)
• Surface Finish: ENIG, Lead‑free HASL, OSP, Immersion Silver
• Assembly Technology: SMT, Through‑Hole (THT), Mixed Technology
• Component Size: passives to 01005; fine‑pitch BGA (0.25 mm), QFN, CSP
• Protective Measures: conformal coating, potting/encapsulation
• Testing Protocols: AOI, X‑Ray, ICT, FCT
• File Formats Accepted: Gerber RS‑274X, ODB++, Altium; BOM (Excel/CSV)