AI PC NTDRW100

boxEDGEAI Inference

Overview
Powered by NVIDIA® Jetson Orin™ Nano delivering up to 67 TOPS, the NTDRW100 is a fanless AI DIN‑Rail Box PC designed for real‑time inference and vision applications at the edge. It provides a compact footprint for integration into control cabinets and space‑constrained industrial environments, with flexible mounting options and extensive I/O for automation and IoT.

Key Features

• NVIDIA® Jetson Orin™ Nano (up to 67 TOPS)
• 3 x 1 Giga LAN, 1 x 1 Giga LAN with PSE (up to 30 W)
• 4 x USB 3.2 Gen2x1, 1 x USB 2.0, 3 x COM, 1 x CAN
• Isolated DIO (8-in / 8-out)
• Wide-range 9 V to 36 V DC power input with isolation
• Wide operating temperature range: -20°C to +60°C
• DIN‑rail edge computing, fanless architecture

Certifications

• CE
• FCC

Design & Deployment Highlights

• Mounting options: DIN‑Rail (default), mini‑DIN‑Rail (optional), wall mount (optional)
• Compact dimensions: 130 x 68 x 150 mm for easy integration into cabinets and production lines
• Fanless architecture for silent operation, reduced dust intake and improved reliability in harsh environments
• Rich interfaces (multiple USB, COM, LAN, CAN and isolated DIO) to support automation peripherals and sensors

Accessories (included / optional)

• Included: 20‑pin terminal block for DIDO; 3‑pin terminal block for power; 10‑pin terminal block for COM; open wire cable; 3‑pin to 2.5Ø female adapter cable; DIN‑rail mount kits
• Optional: 100–240 V AC to DC adapter (12 V, 120 W); power cord; mini DIN‑rail mount kits; wall mount kits

Specifications

• Model: NTDRW100
• Brand: Winmate
• Processor: NVIDIA® Jetson Orin™ Nano
• Memory: 8 GB LPDDR5 @ 2133 MHz on SOM
• Storage: 1 x M.2 2280 M‑Key NVMe SSD 256 GB (default); optional 512 GB, 1 TB, 2 TB
• Ethernet controller: 1 x 10/100/1000 Mbps (via Orin™ Nano, with PSE up to 30 W); 3 x 10/100/1000 Mbps
• Security: TPM 2.0
• Operating System: Linux (supports NVIDIA Jetpack 6.2) (optional)
• WLAN / BT / WWAN: optional via M.2 expansion
• Expansion ports: 1 x M.2 2230 E‑key (WiFi+BT); 1 x M.2 3042/3052 B‑key (4G/5G)
• Mechanical – Dimensions: 130 x 68 x 150 mm
• Weight: 2.5 kg
• Enclosure: Aluminum and metal housing
• Cooling: Fanless design
• Operating humidity: 10% to 90% RH, non‑condensing
• Operating temperature: -20°C to 60°C
• Storage temperature: -40°C to 70°C
• Shock: default; optional MIL‑STD‑810H Method 516.8 Procedure I
• Vibration: MIL‑STD‑810H Method 514.8 Procedure I
• Certifications: CE, FCC
• IO – USB: 3 x USB 3.2 Gen2x1 (10 Gbps, Type‑A); 1 x USB 2.0 (Type‑A); 1 x USB 3.2 Gen2x1 (Type‑C for OTG)
• IO – Serial: 2 x isolated RS‑232/422/485 (10‑pin terminal block, selectable via jumper, default RS‑232); 1 x isolated RS‑232/422/485 (DB9, selectable via BIOS, default RS‑232)
• IO – LAN: 1 x 10/100/1000 Mbps (via Orin™ Nano, with PSE up to 30 W); 3 x 10/100/1000 Mbps
• IO – Video: 1 x HDMI 2.0b (optional), up to 3840 x 2160 @ 30 Hz
• IO – Audio: Mic in; Line out
• SIM: 1 x nano SIM slot (optional)
• DIDO: 1 x isolated 8‑in / 8‑out DIO (20‑pin terminal block) with 2500 VDC isolation on inputs; outputs 5–30 VDC, sink 500 mA max per channel
• CANBUS: 1 x CAN FD (DB9)
• Power input: 1 x isolated 9–36 V DC via 3‑pin terminal block
• Power rating: 9 V to 36 V DC; PoE (PSE) follows IEEE 802.3at (30 W)
• Control: 1 x Power button with LED; 1 x Recovery button