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The nanoETXexpress specification, a form factor driven by Kontron, is targeted to deliver extremely power-saving COMs with mid to high performance x86 technology on a footprint that is a mere 55 mm x 84 mm. This is 39 percent of the original COM Express™ module Basic form factor 125 x 95 mm footprint and 51 percent of microETXexpress (95mm x 95mm). This new COM form factor is compliant to COM Express™ module size nano from PICMG and is based on COM.0 Type 1 connector. The locations of the identically mapped pin-outs are also 100 percent COM.0 compliant.
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Nexcom has expanded its range of Industrial Computer Solutions with the launch of several new embedded boards and systems which are based on the energy-efficient Intel® Atom™ CPU. For years, Embedded Systems designers have been waiting for a low-power Intel architecture CPU that provides sufficient performance capability for a broad spectrum of applications to be addressed. The new Intel® Atom™ processor fulfils this key role and enables many new embedded and mobile power-efficient applications to be considered.
Nexcom has utilized Intel® Atom™ based technology in a number of its new Embedded Computing Platforms including the ICES 170 ETX Module, the ICES 270 Com-Express Module and EBC 540 5.25” Embedded CPU Board. In addition, the robust NISE 2000 range of Fan-less Computer Systems has also been launched for applications that require a complete system based solution.
All platforms are based on the energy-efficient, yet surprisingly cost-effective Intel® Atom™ N270 1.6GHz processor and offer industrial-grade computing at a commercially acceptable cost. In addition, the N270 CPU is included on Intel’s Embedded Roadmap and therefore has an extended life-time support. The development of these rugged Intel® Atom™ based platforms underlines Nexcom’s commitment to develop new industrial computing solutions for vertical markets such as Control and Automation, Digital Signage, Retail, POS, Infotainment and Gaming.
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Computer-on-Module is a series of complete CPU modules that mount onto easily designed application-specific solution boards. Avalue offers COM Express CPU modules, ETX CPU modules and various baseboards to fit different demands. With the modular design, Avalue is able to provide customers 30-day Baseboard Prototyping Service for faster time to market.
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* CPU modules in PC/104 form factor and other sizes
* Embedded solutions with x86, Power PC and ARM9 CPUs
* Extended temperature solutions
* Embedded designs for reliable and rugged industrial use
* Low power consumption starting at 2 watt
* Total solutions with housings (up to IP 67)
* High flexibility, depopulation for cost optimization
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Avalue’s XTX-US15WP is the pioneer of XTX module incorporated with eMenlow platform in the market. The XTX is an extension of ETX form factor. The x2 connector on XTX has advanced functions such as PCIe, SATA, LPC Interface, digital audio and USB. The XTX-US15WP has two LVDS signals for dual display, and a Micro-SD slot on the module for more flexible expansion.
Features:
Intel® Atom™ Z510P / Z530P CPU
Intel® US15WP Chipset
Dual View, Dual LVDS
2 SATA, 6 USB, 1 Micro-SD Slot, 4 COM
1 PCIe x1
Fanless Operation
114mm(L) x 95mm(W)
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Maxiflex Process Automation Controllers
The PAC is based on the Maxiflex P3 CPU platform. The Maxiflex Process Automation Controllers (PAC) run the IEC 61131 Control Applications and are available in a number of variants to suit network preferences.
Ethernet (with Modbus TCP)
Ethernet (Conet)
Modbus
Conet/c
Conet/m (Packet Radio Protocol)
This provides a flexible Network environment satisfying most networked applications and plant topologies. Process Control Applications invariably involve the following functionality for effective implementation.
Interlock Controls
Analogue Signal Processing
Control Algorithms - including PID with Auto-tune
Network Communications
Alarm and Events Monitoring
Date and Time Stamping at source for Sequence of Events monitoring
The ability to service Windows based SCADA systems
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Processor modules MPE200 series
* CPU 400 / 650 / 700 MHz Pentium class
* SRAM: up to 512 Kb (battery backed)
* FRAM: 64 Kb (no battery necessary)
* DRAM: 64 or 128 MB
* FLASH: 8 MB internal
* 1x USB, 1x RS232, 1x RS232 / 422 / 485
* 2x Ethernet 10 / 100 Mbit/s
* Slots: PCC201 / xx, CF200 / xx, 2 PCI slots (M20 system)
Processor modules MPC200 series
* CPU 400 / 650 / 700 MHz Pentium class
* SRAM: up to 512 Kb (battery backed)
* FRAM: 64 Kb (no battery necessary)
* DRAM: 64 or 128 MB
* FLASH: 8 MB internal
* 1x USB, 1x RS232, 1x RS232/422/485
* 2x Ethernet 10 / 100 Mbit / s
* Slots: PCC201 / xx, CF200 / xx
Processor modules MX200 series
* CPU x86 66 MHz Pentium class / CPU 133 MHz Pentium class
* Integrated power supply 17 W / 24 V (MX213)
* NVRAM: 512 Kb
* DRAM: 256 MB
* FLASH: 16 MB internal
* 1x USB
* 1x RS232, 1x RS232 / 422 / 485 (MX213)
* 1x CAN
* Ethernet 10 / 100 Mbit / s
* Slots: PCC201 / xx, CF200 / xx (MX213)
Processor modules ME203 series
* Intel 80386 EX, 33 MHz
* Integrated power supply 17 W / 24 V
* SRAM: 512 Kb (battery backed)
* DRAM: 8 MB
* FLASH: 8 MB File Flash, 2 MB Boot Flash
* 1x RS232, 1x RS232 /422 / 485
* 1x Ethernet 10 / 100 Mbit /s or 1x CAN
* Slots: PCC201 / xx
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Embedded Processors
Embedded processors provide solutions for real-time systems for mass storage, automotive body and power-train, industrial and networking applications.
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DIMM-PC®/520-I with AMD® Elan™ SC520 (133 MHz) CPU with 32MByte DRAM, 32MByte IDE compatible Flash Disk
AMD® Elan™ SC520 CPU with 133MHz
16/32 Mbyte DRAM and 16/32 MB IDE Flashdisk on board
Two serial ports (TTL)
IDE Interface
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Intel XScale IXP420 based Computer-on-Module. Feature optimized and price aggressive.
Intel XScale Processor IXP420
32/64MB soldered SDRAM, 4/8MB soldered Flash
Dual Fast Ethernet
2 terminal interfaces (Rx/Tx)
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X-board® with Intel® PXA255 400MHz, 32MB SDRAM, 16MB Flash
The most cost-efficient multimedia ready board in it´s class
More compact & cost efficient for embedded PC Systems
All advantages of X-Scale architectures at business card size
Low power design - no cooling needed
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S800 I/O is a comprehensive, distributed and modular process I/O system that communicates with parent controllers over industry-standard field buses. Thanks to its broad connectivity it fits a wide range of process controllers from ABB and others.
By permitting installation in the field, close to sensors and actuators, S800 I/O reduces the installation cost by reducing the cost of cabling. And thanks to features such as "hot swap" of modules, "on-line" reconfiguration and redundancy options, it contributes to keeping production -- and thereby profits up.
S800 I/O features include:
- Comprehensive coverage
- Flexible configuration and installation
- Ease of set up
- Reliability and accuracy
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| ... products without technical information |
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