Infrared photodiodes

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For more detailed product information and technical datasheets, please visit http://catalog.osram-os.com 115 Infrared Components Summary of Types Silicon Photodetectors Dual photodiodes Page 132 TO39 SFH 221 DIL BPX 48 SMT DIL KOM 2125

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112 For more detailed product information and technical datasheets, please visit http://catalog.osram-os.com Infrared Components Summary of Types Silicon Photodetectors PIN Photodiodes with daylight blocking filter matched for 880 nm IRED Page 125 DIL BPW 34 FA TO92 SFH 225 FA / SFH 235 FA

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For more detailed product information and technical datasheets, please visit http://catalog.osram-os.com 113 Infrared Components Summary of Types Silicon Photodetectors For more detailed product information and technical datasheets, please visit http://Infrared Components Summary of Types

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For more detailed product information and technical datasheets, please visit http://catalog.osram-os.com 111 Infrared Components Summary of Types Silicon Photodetectors For more detailed product information and technical datasheets, please visit http://Infrared Components Summary of Types

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Photodetectors catalog.osram-os.com Photodiodes PIN Photodiodes with daylight blocking filter matched for 950 nm IRED Package Type Half angle ö ± Radiant sensitive area typ. ë10% typ. Ordering Code Package I Fig. P Measurement cond. IR Measurement cond. tr, tf typ Measurement cond. [°] [mm2

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. This problem is overcome through the use of two photodiodes. The Channel 0 photodiode, referred to as the CH0 channel, is sensitive to both visible and infrared light, while the Channel 1 photodiode, referred to as CH1, is sensitive primarily to infrared light. Two integrating ADCs convert the photodiode

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Data IR LED Constant Current Sink CH0 ADC CH0 Data Prox Integration CH1 Upper Limit Upper Limit Lower Limit Lower Limit Interrupt I2C Interface GND Detailed Description The TSL2771 light-to-digital device provides on-chip photodiodes, integrating amplifiers, ADCs, accumulators

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) Background Energy (BGE) Optical Crosstalk (OC) Glass Attenuation (GA) Distance (D) Figure 8. Proximity Detection The device has controls for the number of IR pulses (PPCOUNT), the integration time (PTIME), the LED drive current (PDRIVE), and the photodiode configuration (PDIODE) (Figure 9

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Free Pb 300 50 650 2000 100 2000 100 PIN 1 PIN 1 END VIEW 650 50 PIN OUT TOP VIEW 750 150 Photodiode Array Area 295 Nominal 466 10 466 10 CLof Photodiode Array Area CL of Solder Contacts (Note B) 20 Nominal CL of Solder Contacts CL of Photodiode Array Area (Note B) 140

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a given current will increase the sensor sensitivity. Sensitivity grows by the square root of the number of pulses. Each pulse has a 16-ìs period. LED On LED Off 16 s IR LED Pulses Subtract Background Add IR + Background Figure 10. Proximity IR LED Waveform The proximity integration time (PTIME

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when the infrared content of the ambient light is high, such as with incandescent lighting, due to the difference between the silicon detector response and the brightness perceived by the human eye. This problem is overcome in the TSL256x through the use of two photodiodes. One of the photodiodes (channel 0

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infrared) and one infrared-responding photodiode on a single CMOS integrated circuit capable of providing a near-photopic response over an effective 20-bit dynamic range (16-bit resolution). Two integrating ADCs convert the photodiode currents to a digital output that represents the irradiance

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TSL2562, TSL2563 LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER TAOS066N - AUGUST 2010 2 Copyright 2010, TAOS Inc. The LUMENOLOGY Company www.taosinc.com Functional Block Diagram Two-Wire Serial Interface Address Select Interrupt SDA VDD = 2.4 V to 2.6 V Channel 0 Visible and IR Channel

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Normalized Responsivity 300 Channel 1 Photodiode Channel 0 Photodiode Figure 5 NORMALIZED RESPONSIVITY vs. ANGULAR DISPLACEMENT ? CS PACKAGE - Angular Displacement - ° Normalized Responsivity 0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 Optical Axis Figure 6 NORMALIZED RESPONSIVITY vs

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. The top of the photodiode active area is 410 ìm below the top surface of the package. D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53. E. This drawing is subject to change without notice. Figure 23. Package CS ? Six-Lead Chipscale Packaging Configuration

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when the infrared content of the ambient light is high, such as with incandescent lighting, due to the difference between the silicon detector response and the brightness perceived by the human eye. This problem is overcome in the TSL256x through the use of two photodiodes. One of the photodiodes (channel 0

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infrared) and one infrared-responding photodiode on a single CMOS integrated circuit capable of providing a near-photopic response over an effective 20-bit dynamic range (16-bit resolution). Two integrating ADCs convert the photodiode currents to a digital output that represents the irradiance

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TSL2562, TSL2563 LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER TAOS066N - AUGUST 2010 2 Copyright 2010, TAOS Inc. The LUMENOLOGY Company www.taosinc.com Functional Block Diagram Two-Wire Serial Interface Address Select Interrupt SDA VDD = 2.4 V to 2.6 V Channel 0 Visible and IR Channel

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Normalized Responsivity 300 Channel 1 Photodiode Channel 0 Photodiode Figure 5 NORMALIZED RESPONSIVITY vs. ANGULAR DISPLACEMENT ? CS PACKAGE - Angular Displacement - ° Normalized Responsivity 0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 Optical Axis Figure 6 NORMALIZED RESPONSIVITY vs

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. The top of the photodiode active area is 410 ìm below the top surface of the package. D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53. E. This drawing is subject to change without notice. Figure 23. Package CS ? Six-Lead Chipscale Packaging Configuration

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48 Sample Arm Tare Arm Photodiode Flag Infrared LED THERMOBALANCE The heart of a Q500 / Q50 TGA is the accurate and reliable vertical thermobalance housed in a temperature-compensated environment. Unlike competitive instruments, no expensive circulator is required for optimal performance

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70 Sample Cup Sample Holder Thermocouple Balance Arm Sample/Reference Cups Balance/Thermocouple Beams Reactive Gas Inlet Photodiodes Dual-Balance Mechanism and Sensors Furnace Horizontal Purge Gas flow

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54 Q5000 IR Platinum (50 and 100 ìL), high temperature platinum-HT (100 ìl), ceramic (100 and 250 ìL), and aluminum open (80 ìL) and sealed (20 ìL) pans are available for the Q5000 IR TGA. Platinum pans are recommended for most applications (ambient to 700 °C) for inertness and ease

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FASTER SEPARATIONS For routine separation of organic and inorganic components, the agile response of the infrared furnace in the Q5000 IR sharply reduces sample analysis time by fast heating and quick cool-down. The figure below shows the determination of carbonate filler in a polypropylene matrix

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AUTOSAMPLER The integrated Q5000 IR Autosampler features a programmable, 25-sample carousel and provides a new level of performance, flexibility and reliability in TGA sample analysis. All aspects of sample testing are automated and software controlled. Autosampler productivity is maximized