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ForeSightTM Vision Inspection Station from Delkor Systems visually scans and evaluates up to 500 individual product containers per minute. The ForeSight’s vision sensor technology scans the surface features of each package to identify missing, misaligned or damaged closure components, as well as tipped, double-stacked or wrong-size containers.
The ForeSight system evaluates each product’s visual image against a quality-standard algorithm in software to determine which items have to be diverted from normal product flow. For defective parts, the software activates a nondestructive reject mechanism to safely direct the non-conforming package onto a sidetrack conveyor where it can be manually inspected and, possibly, re-introduced into the product stream, thereby reducing waste. Initial applications include the inspection of lid and overcap closures for cultured dairy products in tapered cup containers.
The ForeSight Vision Inspection Station is engineered and constructed to provide a NEMA 4 level of protection to withstand the washdown environment common to the food and beverage industries
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YXLON unipolar constant potential X-ray systems include 2.25 kW and 4.5 kW versions. The 2.25 kW X-ray systems have been designed and configured primarily for use in manual, semi-automated and fully automated radioscopic applications. The high energy and high dose rates of the unipolar 4.5 kW X-ray systems make them excellent candidates not only for radiographic and radioscopic applications but also for dosimetry and scanning methods like computertomography.
The typical application of each X-ray system is tailored towards specific target areas like low density applications, biological specimens (pathology), plastics and rubber compounds (MG103) and aluminum and steel applications like casting X-ray inspection (MG165 and MG226).
The unipolar 40kHz X-ray systems feature a very high output stability, a precise energy setting and an extremely fast change over to any selected new value. Any fluctuation or deviation of set values is controlled and corrected within microseconds. In addition these features reduce inspection times considerably and highly qualify the X-ray systems for inline inspection in fast, completely automated production lines.
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RAYCON is a product inspection system consisting of X-ray system and conveyor.
Typical applications:
• accurate and consistent detection of magnetic and non-magnetic metals, glass, ceramic, stone, bone, PVC, Teflon, rubber, reinforced plastics etc in foods
• identification of defects such as agglomerated, broken or misshapen product
• checks for low fill even in sealed packs (eg missing components)
• identification of air inclusions in sealed packs (eg tubes and cans)
• checks weight of entire product or individual areas/components and integral evaluation of over/underweight
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YXLON tire inspection systems can be used for a variety of applications: whether testing prototypes under load or quality ensuring inline mass production, whether investigating passenger cars, truck bus or off the road tires – the high resolution of images produces by YXLON´s non destructive testing systems, enables you to take fast and fact based decisions.
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Food product processing requires a variety of operations, such as sorting based on dimensions, shape and colour, on processing lines that run at very high speeds.
LMI's non-contact sensor vision technologies are ideal for such applications. Integrated into a single rugged and lightweight housing, our sensors dramatically reduce the costs and calibration challenges associated with machine vision component implementation. This measurably increases the quality of the final product by supplying our customers with synchronized real-time data for 100% inspection via smart sensors.
Our Food applications division works closely with System Integrators & Original Equipment Machine Suppliers to deliver the most effective solutions for their particular sensor vision needs.
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FQA - Film Quality Analyzer
Extrusion line for Determination of Film Quality
Stand-alone extruder KE 30 with Film quality analyzer and FSR
The Film Quality Analyzer measures the transparency and optically checks the quality of blown or flat films on a laboratory or production scale. The instrument detects in-line and differentiates between
- black specks
- gels
- fisheyes
- holes
These faults are classified acc. to their type and allocated to size classes.
The film is assessed on the basis of the number of faults and their size distribution.
Evaluation is done automatically through a comfortable Windows® 9x or NT software.
All data are stored in a database and can be imported by commercial programs.
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Plastic Container Inspection System - The TapTone 4000-PBI is designed to detect leaks in plastic containers, stand-up pouches and tubes at production line speeds. Utilizing advanced DSP technology and fail-saife control logic, the TapTone 4000-PBI inspects 100% of production for micro leaks. When combined with optional sensors, the TapTone 4000-PBI can also detect low fills, over fills, and closure defects.
Dual Sensor Compression Technology - detects and rejects leaking and demaaged flexible containers at production line speeds up to 200 feet per minute. The system is designed with dual parallel chains suspended over the customer's existing conveying system. As the container passes through the system, the dual parallel chains apply force to the sidewall of the container. This action compresses the headspace of the container, which allows a comparative measurement to be taken at both the infeed and the discharge of the system. Comparing the container to itself at the infeed and the discharge of the systems eliminates the effects of typical variations seen in the production environment (fill level, product temperature, and container desity). Utilizing advanced DSP technology the TapTone 4000 controller analyzes the comparative measurement and assigns a merit value to each container. If the merit value is outside of the acceptable range, a reject signal activates a remote reject system.
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INSPECTION MACHINE
FRONT-REAR FOR TUBOLAR FABRICS
Mod. ISD 220
The inspection, winding machine, ISN NO STOP,
allows a check the quality of the front and the rear side of the fabric.
Thanks to the linear geometry and to a new system of drew-in of the fabric, the machine is able to check both the fabrics tubular that the fabrics in open, the new system of wrapping allows besides to wind the roll in hourly sense or ant-clockwise.
The machine is excellently for the verification of elastic fabrics to sweater and shuttle.
Besides, thanks to the management from PLC managed to inverter, and to the sensitive system of synchronization and the motorization of all the cylinders of transport fabric, the operator can modify in time real tension plotted and compactness roll.
Technical characteristics:
• Inlet fabric from Roll of plait
• Special draw-in of the fabric
• Double inclined inspection table with rear light
• Up light
• Auto-centring winding unit
• Winding of the roll in clockwise sense or ant-clockwise sense
• Adjustable compactness of the rolls
• Adjustable fabric tension
• ø500 mm diameter knitted fabric rolls
• 3÷60 m/min. speed control without step.
Optional:
• Digital weight measuring system
• Automatic linear cut
• Wood or special light
• Comatex software for store all the faults
• Barcode labelling for more type of error
• Mark-fault one or more fault
• Doubling system in 2 or 4
• Packing system
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- MS Side frames pointed with hardwearing stipple finish stowing enamel . This makes the finish permanent..
- -A cradle with tow M.S. side brackets and 6 rollers running on ball bearing to place the fabric roll. This arrangement allows tensionless unwinding of the fabric.
- Inspection table is laminated black/white, which enhances the defect identification procedure by making defects more easily visible to the operator.
- The angle of the table is changeable in order to allow the operator to select the right viewing angle. Also, mending of the fabric is easily possible due to this arrangement.
- Two overhead and two underneath tube lights are provided to optimize the lighting.
- Positive driven batch winding mounted on M.S. fabricated frames having two rubber strip coated rollers and batching roll guides. The fabric is wound on the batch roll by surface contact.
- A scroll rolls right after the inspection table opens the fabric roll.
- A bow bar is also provided to open the fabric right before the winding, which gives perfectly wound tight rolls.
- This winding arrangements winds rolls by 25% tighter than the traditional winding mechanisms.
- Measuring Counter is provided in front on the inspection table for easy viewing
- FORWARD/REVERSE/STOP push button controls mounted on inspection table on both sides.
- A special jogging (Inching) device is also provided.
- Soft start and instantaneous stoppage of fabric.
- MCB's to automatically stop the machine at the time overloading.
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Next Dimension - ND300
Designed to maximize uptime and throughput, the ND300 gear measurement system includes:
- Intuitive, user-friendly navigation based on the Microsoft Windows® software platform, making it easy to use, reliable, customizable and easily upgraded
- The ability to measure a gear or related features in relation to functional datums and/or compare measurements to manufacturing datums thus eliminating the need for expensive tooling or fixtures
- A modular design approach to the hardware and software allowing for easy system upgrades and expansions
- The ability to compare output results in multiple gear standards simultaneously
- Complete user control over the format of the analysis reports generated - the user can choose to plot profile, helix, index, pitch, and tooth thickness along with standard analyzed parameters and accuracy class all on one page!
- True 3D measurements in an error-compensated work envelope produced by PECo’s proprietary data acquisition algorithms and Renishaw® 3D probe technology
- A 3-year warranty and world-class service and support
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Today, more than 3000 LMI/Selcom™ laser triangulation sensors are used throughout the tire manufacturing process worldwide. Sensors monitor thickness, profile and ply overlap, to name just a few applications. In-process sensing provides immediate feedback at critical stages in the production process. In this manner, faults may be found immediately and corrective action quickly applied.
Providing reliable data from surfaces with rapidly changing colour and surface properties, LMI systems integrate high frequency response 2D and 3D profiles from surfaces, monitoring items such as radial run-out, side wall profiles and tread extrusion contours.
Our Rubber & Tire applications division works closely with System Integrators & Original Equipment Machine Suppliers and Tire Manufacturers to deliver the most effective solutions for their particular sensor vision needs.
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GE Inspection Technologies designs, manufactures and supports stationary testing machines based on ultrasonic and X-ray technology for online and offline applications in the manufacturing processes as well as mobile systems for field applications. In addition, we offer systems based on Eddy Current technology and special systems in the field of metrology.
Our testing machines and systems are designed to perform individual manufacturing tests and / or to fulfill international Nondestructive Testing (NDT) standards for final acceptance test.
We offer a wide range of standard systems for numerous applications – including all former Krautkramer, Seifert and Nutronik products – to suit all specifications. Additionally, we can provide a customized solution for your specific need.
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DYXIM X-ray inspection systems from Sartorius check packed and unpacked bulk products for the widest variety of contamination including glass, metal, stones and other particles within the production process and safely lock out contaminated products.
There are 3 different versions: DYXIM - S (Single Shooter) - D (Double Shooter) and - FB (Conveyor Machine).
– Detection of metal, glass, stones, bones, ceramic and certain plastic components (PVC)
– Completeness control
– Dyxim D series for glass in glass applications
– Control of shape, volume and dimensions
– Weight control and detection of voids within the product
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Dynamic Systems Testing
Zwick provides test rigs and portal frames for the dynamic testing of systems components, which are designed in conjunction with your needs.
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Sprint CNC™ fits on a workbench and provides stage travels as large as 12" x 12". Use the handy joystick to move the part and optics. Precise autofocus speeds throughput and improves repeatability. Run programs for all your parts to keep your quality in control.
Sprint CNC Features:
- 0.5-micron XYZ axis scales
- LED back light
- VectorLight™ ring light
- Optional LED on-axis illumination
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SmartScope® MVP is the cost-effective way to get the benefits of video-based inspection and measurement from the leading name in the industry - Optical Gaging Products (OGP®).
Motorized benchtop SmartScope MVPs have a granite base and column, quality 6.5:1 zoom lens, and mechanical bearing translation stages for accurate positioning in every axis.
Measure-X® software makes it easy to create part routines using video and multisensor metrology. The touch probe option adds multisensor functionality, extending the versatility of SmartScope measurement systems.
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The double flank gear rolling inspection is an easy and quick inspection method for gears. The inspection process can be carried out on the shop floor. It immediately enables the user to evaluate gears with regard to the total errors caused in production.
The double flank gear rolling inspection is, if used with modern evaluation equipment such as a PC, hardware and software, a very efficient and quick way of ensuring quality without any problems.
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Our multipoint measuring devices, measuring computers and measuring machines are used for measuring engine, gear and chassis components. With the HOMMEL GAUGELINE we offer our customers dimensional measuring methods which can be integrated individually in the production processes.
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Universal Gear Tester GMX 275, the accurate and fast solution for Gear analysis.The GMX 275 covers a wide range of applications for the gearing world up to 275 mm OD.
- High accuracy gear measurement with a Class 1 gear tester.
- Fast and effective through integrated Power PC technology
- Wide range of applications for gears and gear tools for guaranteed success.
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LPKF ScanCheck I+
The LPKF ScanCheck I+ Stencil Inspection System compares solder paste stencils manufactured by any method with the CAM data. The stencil supplier is thereby able to guarantee continuous quality of the stencils.
For the SMD assembly houses LPKF ScanCheck I+ provides quality assurance for all stencils before assembly production begins. After use and cleaning the stencil can be examined for blockages.
ScanCheck recognises all stencil defects such as missing apertures, wrongly shaped apertures, positional inaccuracies and, after use, any contamination
For the packaging industry in particular with the extremely high requirement for quality stencils there is no economic alternative to LPKF ScanCheck I+
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The IP321 combines conversion of Gerber data and the automatic recognition function for ease of programming. New data can be created easily and rapidly as compared with manual input.
The IP321 supports lead-free solder inspection and analyzes placement quality - it's optimally efficient.
Features & Benefits
Real time 100% inspection at in-line speeds
High resolution of up to 10 µm enables inspection of printed solder with a 0.4mm pitch
Handles solder-paste printing inspection for a wide variety of components
In-process control, including real-time monitoring
Easy operation & 3D Color Display
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S500 Functional Tester
A flexible, scalable high-performance functional test system tailored to meet your exact requirements for Module and PCB test. Rapidly and reliably giving you a Pass / Fail decision on any electronic module or PCB.
Test results can be passed to the PinPoint PCB Diagnostic Test System for rapid identification of any failure.
Designed to use industry standard hardware and software, the system can be configured and expanded to meet your changing test demands today and re-deployed in the future.
o Fully Integrated Test Solution
o Flexible open architecture (PXI, VXI, GPIB, Boundary scan)
o Complete solution - from design to through-life support
o Easy to use software Environment
o Fully scalable from desktop to multi-rack system
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The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
The standard Windows® user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.
Wafer Specifications
* Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
* Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned
* Flat/Notch: All SEMI Standard Flat(s) or Notch
* Conductivity: P or N Type
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape
Measurements
* Thickness and TTV
* Bow
* Warp
* Site and Global Flatness
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The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Easy to Use....
The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 300SA to your process needs
Wafer Specifications
* Diameter: 200mm and 300mm.
* Material: All Semiconducting and Semi-insulating materials.
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
* Flat/Notch: All SEMI Standard Flat(s) or Notch.
* Conductivity: P or N Type.
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.
Measurements
* Thickness and TTV.
* Bow
* Warp
* Site and Global Flatness
Advantages
* Cost effective alternative to fully automated tools.
* Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
* Standard Windows® User Interface.
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Each panel is inspected by a camera system that is installed above the material flow. Defective areas are detected where the surface pattern differs from the normal (perfect) pattern. Each defective area is classified (characterized) in light and dark defects. The operator can easily change the parameters and sorting criteria.
The GreCon system is self-learning. It can distinguish between new patterns and known patterns. For known patterns, the stored image data is simply called up from a database at the beginning of a new order; the system is immediately operational. For new patterns, two successive panels are compared. If the deviations are smaller than the preset tolerance limits, these panels are used as samples. All following panels will then be compared with the new pattern. This procedure is very easy and takes only a few minutes so that the machine can be trained to any kind of pattern in a short time period.
Defects on the top surface of each panel are determined and can be represented on the monitor if desired. The quality is determined by evaluating the data, such as defect type, size and position.
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The shearography tire test systems from Steinbichler Optotechnik have been developed for the non-destructive testing of new tires in R&D and quality control, as well as for the inspection of tire carcasses in the retreading industry. The technical basis of the systems is the TV shearography system.
During the test cycle, a low pressure (e.g., 50 mbar pressure difference) is generated in the vacuum chamber, thereby inducing deformations which are caused by the expansion of air pockets occuring in faulty areas in a tire carcass. With the TV shearography technique - a holographic measurement method which reliably detects material deformations in the range of microns - faulty areas can be localized clearly and reproducably.
The Intact® systems by Steinbichler Optotechnik have successfully proven their functionality in the worldwide car-, truck-, and aircraft industries, as well as in the Formula 1 racing tire business.
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Tire Balancer
Fully Automatic TIRE Balancer
The YAMATO brand tire balancer measures the unbalanced points & value automatically on the tire product line.
Dynamic Tire Balancer
The tire is inflated and then rotated at a constant speed.
The TB-D1 calculates the unbalanced points by measuring the centrifugal force generated from the deviation between the center of rotation and the center of gravity of the tire.
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PV Series
Using MTII's exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer.
Wafer saw mark detection and classification is accomplished by adding optional laser sensors to the PV-1000 module. Utilizing up to two of MTII's industry leading Microtrak - SA standalone laser heads, saw marks can be classified for orientation and depth simultaneously with wafer thickness scanning making the PV-1000 ideal for incoming wafer characterization and sorting.
Integrated data acquisition and control electronics analyze and transmit wafer data via the on-board Ethernet port at speeds of up to five wafers per second. The digital I/O port allows communication with wafer handling equipment for up to 64 classes of wafer sorting and binning. Remote monitoring capabilities allow you to see your production line data across your network or directly at the module.
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Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:
* Silicon
* Gallium-Arsenide
* Indium Phosphide
* Germanium
...without recalibrating or electrically grounding the wafer.
Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)
Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.
An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.
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