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Metallurgy
Aluminium cleaning.
Metal reduction/antioxidizing atmospheres.
Here is an example of ultra fast copper cleaning made with a reducing atmosphere with the ULS device
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The PSX307 plasma cleaner provides 1.5 times the productivity of conventional models. Parallel plate chamber technology delivers superior etch uniformity over conventional batch systems.
Ultra-thin gold-plated electrodes can be wire bonded reliably without nickel compound formation via argon plasma treatment. Gold plating savings alone can provide ROI justification.
Other capabilities include surface modification by oxygen plasma improving mold resin adhesion and under-fill wettability, and reducing incidence of peel-off, voids, and cracks.
Panasonic plasma cleaning equipment sets the standard; thereby, refining tomorrow's technology today.
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