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STA 449 F1 Jupiter® – Simultaneous TG-DSC
Fascinating Flexibility in Thermal Analysis
The new STA 449 F1 Jupiter® combines unlimited configuration flexibility and unmatched performance in just one instruments.
● Thermal stability, decomposition behavior, composition, phase transitions, melting processes to be analyzed comprehensively and quickly
● Easily to use top-loading system with exceptionally precise balance resolution (25 ng resolution at a weighing range of 5g) and highest long-term stability
● Interchangeable sensors for DSC measurements with highest sensitivity and best reproducibility for reaction/transition temperatures and enthalpies as well as for measurements of specific heat
● A variety of optional system enhancements for ideal system adaption to user-defined applications
● Various furnaces, easily interchangeable by the user, available (optional a swiveling double hoisting device for two furnaces)
● Pluggable sample carriers (TG, TG-DSC, TG-DTA, etc.)
● Automatic Sample Changer (ASC) for up to 20 samples
● Automatic evacuation and refilling (Autovac)
● Plenty of accessories, e.g. sample crucibles in the most varied of forms and materials
● Unique for STA: temperature-modulated DSC (TM-DSC)
By supplementary MS-and/or FTIR-coupling even more comprehensive analyzes are possible.
All these features make the new developed STA 449 F1 Jupiter® to the ideal tool for thermal analysis of materials in the fields of research, developments and quality assurance.
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Fascinating Flexibility in Thermal Analysis
DSC 404 F3 Pegasus® - High-Temperature DSC
The new DSC 404 F3 Pegasus® offers a high flexibility for all DSC and DTA applications in quality control and product development. Furnaces and DSC/DTA sensors are available for a broad temperature range (-150...2000°C). Numerous upgrade possibilities allow adaption of this cost-effective system to sophisticated applications.
The DSC 404 F3 Pegasus® is part of the economical NETZSCH F3-product line, which is specially tailored to the requirements of comparative material characterization and quality control.
The DSC 404 F3 Pegasus® can be operated from -150°C to 2000°C with various DTA and DSC sensors that are easily exchangeable by the user and various furnace types.
The sample chamber can be purged with inert or oxidizing gases in order to remove gases evolved from the sample.
The measuring system is vacuum tight (10-2mbar).
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SETSYS Evolution: High Performance Thermal Analyzers (ambient to 2400°C): DTA, DSC, TGA, simultaneous TGA-DTA/DSC, TMA, coupling to gas analyzers
Widest temperature range (ambient / 2400°C) on the market
Modularity: the different modules DTA, DSC, TGA, TMA can be adapted interchangeably around the same structure
Measurement performance: satisfy unique resolution, precision and sensitivity criteria
SETSYS Evolution is today the state-of-the-art in research-grade thermal analyzers.
It includes:
-SETSYS Evolution DTA (up to 2400°C), DSC (up to 1600°C)
-SETSYS Evolution TGA
-SETSYS Evolution simultaneous TGA-DTA/DSC-EGA
-SETSYS Evolution TMA
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The QuickLine™-50 instrument is a device specifically developed for measuring interface thermal resistance.
Heat transport across gaps is most frequently improved by the addition of a layer of conductive material that fills the crevices in between, and with that thermally bridges the gap. Heat transfer is then governed by the thermal conductivity of the material, the thickness of the layer, and the two interfaces at the boundaries of the layer. For most engineering applications it is extremely difficult to model this combination from its components, as exact figures for the boundary resistances are usually not known. Further aggravating this is the effect varying surface conditions can bring to the interface. For this reason it is becoming general practice to measure the combination that closely replicates actual use, and determine experimentally the interface impedance of the filler and the two interfaces combined.
* Thermal Interface Materials
* Fast Test Times
* RT to 150°C
* Variable (controlled) Loading
* Easy to use
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The new GHP 456 Titan® is the ideal tool for researchers and scientists in the field of insulation testing. Based on the well-known, standardized guarded hot plate technique (e.g. ISO 8302, ASTM C 177 or DIN EN 12667), the system features unrivalled performance over an unmatched temperature range.
Combining state-of-the-art technology with the highest quality standards, NETZSCH has designed a robust and easy-to-operate instrument, featuring unparalleled reliability and optimum accuracy over a broad temperature range.
The GHP 456 Titan® works with sheeted individually calibrated PT100 resistance temperature sensors (resolution 1 mK, accuracy in the range of a few 10 mK). Due to special sheeting, the sensors can be used up to 700°C (+ more than 100 K safety range).
The NETZSCH GHP 456 Titan® is the new benchmark in Guarded Hot Plate measurements.
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TCT 426 - Thermal Conductivity Tester: furnace/hot-wire method
The TCT 426 works according to the hot wire method and is especially designed for the investigation of refractory rock. The measuring cross, parallel wire, and T(R) methods can be used in the instrument. The TCT 426 is indispensable for the efficient use of energy in industrial kiln engineering with refractories.
The hot-wire method is an absolute method for direct determination of the thermal conductivity, based on the measurement of the temperature increase of a linear heat source/hot wire (cross-wire technique) or at a specific distance from a linear heat source (parallel-wire technique).
The hot wire and thermocouple are embedded between two test pieces, which make up the actual test assembly. The time-dependent temperature increase after the heating current is switched on is a measure of the thermal conductivity of the material being tested.
Another variation, the so-called "Platinum Resistance Thermometer Technique" or "T(R) Technique", is described in ASTM-C 1113. Here an integral temperature measurement is carried out over the entire length of the hot wire; i.e. the hot wire is both heat source and temperature sensor at the same time.
The TCT 426 thermal conductivity tester enables the use of all three of the methods described in easily interchangeable, pre-wired measuring frames.
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Model Unitherm 6000 Guarded Hot Plate Thermal Conductivity Measuring System
* -175°C to 550°C, in several ranges
* Guarded hot plate method
* Fully automated operation
* For insulating materials
* 300 mm square samples
* ASTM C177, ISO 8302
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Model Unitherm 2022 Thermal Conductivity Measurement Instrument
* -20°C to 300°C
* Guarded Heat Flow Meter
* Fully computerized operation
* 2'' dia. sample
* Solids, pastes, liquids
* Filled polymers
* ASTM E1530
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Model FireLine 1000 Thermal Conductivity Measuring System
* RT to 1000°C
* Fire protective materials & insulation
* 150 mm square samples
* Slug calorimeter method
* ASTM E-2584-07
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Model QuickLine -10 Thermal Conductivity Meter
* Ambient temperature operation
* Guarded heat flow meter
* Manual or computerized operation
* 2 inch dia. sample
* Solids, pastes, liquids
* Filled polymers
* ASTM E1530
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Simulate More Reliably
Industry Standard Engineering Analysis Solutions
MSC.Software's engineering analysis technologies serve as the rock-solid foundation for the most reliable enterprise simulation results. MSC's best-in-class, industry-standard analysis technology, including Nastran, Adams, Marc, Dytran, Easy5, and Patran, power the advanced simulation capabilities of SimEnterprise Solutions.
Covering the full spectrum of engineering analysis from structural linear, nonlinear, and explicit nonlinear to computational fluid dynamics, fluid structure interaction, and more, MSC.Software's engineering analysis tools help you analyze virtually any product design, from the simplest components to complex assemblies. These technologies have become the standard for mechanical, structural, and mutli-body dynamics simulation in several industries, and manufacturers depend on these tools for highly reliable virtual test results.
As an integral part of your simulation environment, these analysis tools can be used standalone, or as part of a broader MD simulation solution. Whether there is an expert analyst or a designer using an MSC workspace environment, commonality of the underlying solver foundation ensures repeatable results and maximum reliability and performance.
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Implementing a completely virtual product development system saves money and moves products to market faster. But many companies don't implement such a system because of the high cost of CAE software. Fortunately, there is a low-cost alternative that gives even beginning users access to a considerable amount of simulation power.
ANSYS Professional is an inexpensive, easy-to-use program for structural/thermal analysis projects. Containing the power of the industry's leading simulation technology, ANSYS Professional gives users high-level simulation capability without the need for high-level expertise. It comes complete with a full contingent of linear elements, significant nonlinearities, the ability to solve complex assemblies-cluding shell-to-solid-and the most requested set of solvers.
First-time users can access the ANSYS Workbench environment and easily proceed through the simulation step-by-step. The ANSYS Workbench is a new-generation tool that offers an efficient and intuitive user interface, superior CAD integration, automatic meshing, access to model parameters, and access to much of the functionality available in ANSYS Professional, all within one environment. As additional simulation capability is required, the user can move up to the newly revised, single-window ANSYS environment.
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CALISTO is a NEW software developed for Thermal Analysis applications from DSC, TGA, TMA and Calorimetry.
CALISTO comprises two independent parts:
- CALISTO ACQUISITION for the control of SETARAM Thermal Analysis Systems
- CALISTO PROCESSING for the treatment of ANY Thermal Analysis Data independent of instrument type or manufacturer.
CALISTO ACQUISITION
- Program acquisition procedures (all experimental conditions and parameters)
- Control one or more Setaram systems via a PC
- Save experiment signals and monitor their progress in real time
- Change experimental conditions during an experiment
- Trigger acquisition of other equipment (mass spectrometers, FTIR)
CALISTO ACQUISITION software is available for the exciting NEW range of EVO products and is also compatible with existing SETARAM products.
CALISTO ACQUISITION provides a unique combination of ease-of-use and intuitive operation as well as powerful control of your Setaram systems.
CALISTO PROCESSING
- Imports files saved in CALISTO Acquisition
- Imports signal files from other equipment (mass spectrometers, FTIR)
- Treats recorded signals
CALISTO PROCESSING offers the most powerfull tools available for Baseline Selection / Substraction, Peak deconvolution / Separation, Data Presentation, Data Export , Cp (Heat Capacity) determination.
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TAS is a system designed to computer simulate nearly any thermal problem you have.
Problems are simulated geometrically using 2D Plate and 3D Brick and Tetrahedron elements. TAS can accurately represent skewed elements. TAS uses a Finite Element method to convert geometry into an accurate resistor/capacitor representation which is then accurately and quickly solved using a finite difference or Conjugate Gradient method. This combination gives accurate results like other Finite Element (FEA) solver and provides you with unsurpassed flexibility in model generation. There are no limits to model size, only limited to PC memory.
Complete, no other tools are required
Complete model generation, solving and post processing in one environment
On-line and context sensitive help
Built-in steady state and transient finite difference solvers
Model size only limited by available memory
Electronic components
Satellites, interfaces with TRASYS, TSS, RadCAD and Thermal Desktop
Printed circuit boards
Medical instruments
Air and liquid cold plates
Heat sinks
Interface with ANSYS, Nastran, FEMAP, SINDA/G and SINDA/FLUINT
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ANSYS Multiphysics integrates the power of direct (matrix) and sequential (load vector) coupling to combine the appropriate "physical fields" required for accurate, reliable simulation results in applications ranging from cooling systems, power generation, to biotechnology and Micro Electro Mechanical Systems (MEMS). The software easily simulates complex thermal-mechanical, fluid-structural and electrostatic-structural interactions, and includes the complete range of powerful ANSYS iterative, direct and eigenvalue matrix solvers.
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Portunus is a system simulator that has been developed especially for the calculation of mechatronic systems. Possible applications range from the simulation of drive systems and switched mode power supplies to investigation of the heating of electronic components.
Several description approaches (network, block diagram, state machine) are available for the simulation of electrical, mechanical and thermal systems. With Portunus you may run different analysis types (simulations in the time and frequency domain, calculation of steady-state and operating point). The effect of parameter variations may be calculated and displayed automatically. Alternatively, it can be visualized using the interactive capabilities of the software.
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Pro/ENGINEER Mechanica
Gain product insight
Costly and laborious prototyping hinders a design team, resulting in compromised schedules and budgets. However, with Pro/ENGINEER Mechanica, designer engineers can better understand product performance, and accommodate the digital design accordingly -- all without needing a specialist’s FEA-background. The result: engineering gains early product insight, improves verification and validation processes, and delivers higher quality products at lower cost.
Benefits
- Conduct standard analysis types, including linear static, modal, buckling, contact and steady state thermal
- Obtain real-world performance data by directly applying conditions to design geometry without requiring data translation
- Fast, automatic solution convergence, mapped precisely to underlying CAD geometry; 3rd party solver output
- Increase innovation by simultaneously designing and simulating results of design variations
- Decreases development costs through reduction or even elimination of physical prototyping and productive, engineering-friendly user interface
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SAMCEF Field is a fully integrated CAE environment for linear and non-linear structural and thermo-mechanical analyses, for multibody simulation based on FE methods and for multiphysics problems.
SAMCEF Field allows you to design your systems with a simple click, using pop-up menus, icon bars, shortcuts or keyboard commands. Design, modeling, analysis and results post-processing operations are driven in a fully contextual and single environment.
Indeed, in addition to its interfaces with CAD, its local modeler and its powerful meshers, SAMCEF Field supports:
- linear analysis (static, modal, buckling);
- stationary thermal analysis;
- non-linear structural analysis;
- multi-body simulation;
- composite materials analysis in both linear and non linear conditions.
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"Highly recommended" by Cadalyst Magazine, thinkdesign® streamlines product development for small to mid-sized manufacturers (SMMs). Unlike other MCAD products, thinkdesign has been designed from the ground up. Working closely with our customers we've developed%u2014in a single package%u2014the efficiency of 2D AND the power and precision of 3D. With think3 technology users can easily switch to 3D, without losing even one hour of work! Compare our features and benefits. thinkdesign capabilities include:
2D/3D transparency in a single design environment. Unsurpassed interoperability between the two eliminates costly interfaces
thinkPLM foundation. Seamless integration with thinkPLM, our scalable, ready-to-use PLM solution
Advanced AutoCAD compatibility. Users can import 2D AutoCAD drawings into thinkdesign, modify and reuse those drawings as if they were native
Robust part modeling, advanced design tools and UI. Users can design any conceivable part in a single, easy-to-use design environment. Drawings can be created automatically from 3D models
Design flexibility for manufacturable sheet metal parts. Sheet Metal parts can be created from scratch or from existing parts, including IGES and STEP
Smart objects. Store engineering knowledge into the system, for faster adoption and higher quality in 3D modeling
Advanced large assembly capabilities. Users quickly navigate with Light Representations of components and Visual Bookmarks; Symbolic References enable any replacement of components, preserving assembly integrity
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SIMULIA Extended Analysis extends the CATIA V5 Analysis capabilities. Designers looking to quickly evaluate real world performance and deliver the right design, the first time, now can enhance their product simulation methods to include basic nonlinear and thermal analysis.
The existing CATIA Analysis products are ideal for designers who want to evaluate their designs, but are limited to the linear structural response of parts and assemblies. Many products are subject to both thermal and structural loads, or are made of materials like rubber that are inherently nonlinear. Designers may also want to study the effect of overload conditions when the product might suffer permanent deformation.
SIMULIA Extended Analysis addresses this need with the introduction of two analysis products, Nonlinear Structural Analysis (ANL) and Thermal Analysis (ATH). These products are intended for designers looking to accurately size designs and quickly evaluate real world performance
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SAMCEF Thermal is a general non-linear thermal analysis program for both steady state and transient analysis, taking into account conduction, convection and radiation. Because SAMCEF Thermal shares its infrastructure with SAMCEF Mecano, both thermo-mechanical chaining as well as the inclusion of, for example, numerical controllers is straightforward.
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Problems involving any combination of conduction, convection,
and radiation are solved easily with the Heat Transfer Module.
It finds extensive use in systems that involve the
generation and flow of heat in any form.
A variety of specialized modeling interfaces
are available for different formulations
and applications such as
surface-to-surface radiation,
nonisothermal flow, heat transfer
in structures made of thin layers
and shells, and heat transfer in
biological tissue.
The Heat Transfer Module allows for arbitrary couplings to other application modes in COMSOL Multiphysics and its modules for multiphysics modeling. This is particularly relevant to applications such as thermal management in the electronics industry, thermal processing and manufacturing, and medical technology and bioengineering.
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• Engineering Fluid Dynamics (EFD) is a different breed of Computational Fluid Dynamics (CFD) software that helps mechanical design engineers analyze and optimize complex fluid flow and heat transfer processes across a wide range of products and industries. FloEFD is based on the same mathematical foundation and numerical simulation in fluid dynamics as traditional CFD software, but 7 key technologies set FloEFD apart, making it quicker and easier to use, more robust, and more accurate. .
FloEFD is designed for use by engineers and is radically different from traditional CFD software in that it completely removes the complexities of numerical/mathematical schemes and computational mesh creation from the user, allowing engineers to focus on optimizing their designs in the shortest possible time. Also since FloEFD is embedded in CAD it uses 3D MCAD models directly – without the need for translation or data transfer. The FloEFD suite has been used in the design of various products from across a wide range of industries such as aerospace, automotive, medical devices, industrial machinery and pumps/ valves.
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The state-of-the art IRBIS® 3 software package designed by InfraTec represents the ideal tool for fast analysis of thermographic image data and for comfortably drafting WORD reports. Packages of several levels are available with application specifi c expansion modules. IRBIS® 3 is compatible with all thermographic cameras of the InfraTec product range.
The revolutionary operating concept and intuitive menu navigation provides easy access to even untrained users. In combination with comprehensive analysis and processing functions, IRBIS® 3 guarantees highest efficiency in thermographic image evaluation and report generation.
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