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Thermal Clad Insulated Metal Substrate was developed by Bergquist as a thermal management solution for today's higher watt-density surface mount applications where die size is reduced and heat issues are a major concern. Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard PWB's. These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications.
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Bergquist's Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Sil-Pad products are used by many of the world's largest OEMs in various industries including automotive, computer, power supply, military and motor control.
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Laird Technologies produces some of the world’s highest-rated thermally conductive materials for use in electronic packaging. Our thermal management products include gap fillers (including putties), phase change materials, thermal greases, thermally conductive circuit boards and thermally conductive insulator materials.
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