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Typical Applications
Leak detectors
Mass spectrometers
Electron beam microscopy
TV tube manufacturing
Load locks and transfer chambers
Technical Features
Compact design
Operation in any orientation
Cooling by convection is sufficient for most applications
Air and water cooling can be added easily
Oil-free pump for generating clean high- and ultrahigh-vacuum conditions
Advantages to the User
Space-saving
Easy to integrate into complex vacuum systems
Low operating costs
Highly reliable operation also in processes loaded with particles
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4 PUMPS designed for semiconductor processes
Description Applications
Adixen maglev hybrid turbomolecular pumps
5 corrosion proof features
- Automatic balancing system
- Built-in 75°C heating system
- 5 active axes
- Inert gas purge
- Inverted dynamic seal (only for ATH400 and ATH 1300)
High throughput applications
ATH 400 M, ATH 1300 M,ATH 1600 M and ATH 2300 M are designed for high pressure, high throughput pumping needed for semiconductor and other thin film coating applications.
A compact and modern design
- Adjustable rotational speed for optimizing pumping parameters
- Very high MTBF
- Low cost of ownership
- Low noise and vibration levels
- Battery free
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Turbopumps for all High and Ultra-High Vacuum Applications.
Turbopumps generate vacuums in the high to ultra-high vacuum range
of up to 10-11 mbar.
Applications
In the production of many products of everyday life and in many areas of engineering research, vacuum technology plays a decisive role. Here the turbopump is of decisive importance in providing extremely pure process conditions.
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STP Magnetically Levitated Turbomolecular Pumps
The STP magnetically levitated turbomolecular pumps are the first choice for high-up time, hydrocarbon free pumping. The multi-axis magnetic bearing system is used to suspend the rotor during operation, ensuring there is no risk of contamination while minimizing vibration, noise and maintenance requirements. The STP pumps can be fully interfaced with advanced controllers to operate on a wide range of applications and processes.
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