Chip encapsulation compound DELO

Application areas
Depending on the application area of the chip, the re-
quirements on the chip encapsulation compound, its
processing and resistance to stresses and strains are
very different. The most frequent application areas and
appropriate encapsulation compounds are listed in the
chart below.
You can find more detailed information as well as technical data on optimized products for automotive and industry, customized chip encapsulation compounds for consumer products and globally leading systems for card technology
in the specialist article “New chip encapsulation compounds: The suitable product for any requirement”
our brochure “Chip encapsulation compounds – DELO-KATIOBOND, DELO-MONOPOX”.

More specifications...