To meet the most diverse customer requirements, DELO offers a wide range of heat-curing adhesives under the DELO MONOPOX brand. These are based on different chemical compositions: from epoxy adhesives with different hardener classes such as acid anhydrides or amines to heat-curing cationic epoxy resins and heat-curing acrylates. The portfolio is rounded off by DELO's own product class of mCD adhesives.
Versatile application options
Among the most resistant adhesives
DELO MONOPOX adhesives can easily meet the high requirements for mechanical protection, chemical resistance and temperature resistance in numerous applications. These adhesives are particularly interesting for applications in the automotive industry and in electronics.
The curing temperature of the products in the DELO MONOPOX portfolio ranges from +60 °C, suitable for temperature-sensitive assemblies, up to +150 °C to achieve very durable bonds.
DELO MONOPOX EG products
Optimized for bonding in electronic components (Electronic Grade)
Very low halogen content
High cycle rates possible due to thermode curing
Adjustable mechanics from stress-relieving to high-strength
Used for: Reinforcement, Cap bonding / Lid attach, Camera Modules, etc.
DELO MONOPOX DA products
Developed for chip bonding (Die Attach)
High cycle rates possible through thermode curing
Electrically insulating
Mechanical properties adjustable from stress-relieving to high-strength
Used for: Reinforcement, NCA Die Attach, etc.
DELO MONOPOX AC products
Anisotropic electrically conductive
Reliable electrical contacting
Suitable for contact pads with narrow spacing
Curing achieved through thermocompression