Automatic pick-and-place machine placeALL®520

for LEDsfor BGASMT

The placeALL®520 is a modular Pick&Place system and especially useful to build prototypes and small series. It supports a large range of components (chips, FP-components and BGAs), so even the most complex tasks can be handled. An intelligent software and up to 200 possbile kitting slots minimze changeover times, which increases productivity for small lot sizes. The placeALL®520 can easily be upgraded or integrated into an inline system on Location. Assembling and dispensing of prototypes and zero series, up to 4000 components per hour. Feeding of components from tape, stick, tape stripe, tray and loose components. Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.4 mm, BGAs, CSPs, µBGAs, QFNs and customs parts like connectors, wired LEDs etc. The patented CyberOptics laser centering uses a laser diode to project a beam onto the component. By rotating the part and analyzing the resulting shadow length, the component is aligned. The centering mechanism is mounted directly to the assembly head and aligns the components when the head is moving from the pickup to the placement step. The laser centering can handle components from 0402 chips up to 32 × 32 mm in size and 0.6 mm in pitch. To align components like FP/BGA/CSP/µBGA or custom parts up to 50 × 50 mm and a pitch of 0.4 mm, the stationary camera system is used. With this system components up to 70 × 70 mm including pins (FP) and balls of BGAs can be measured using a camera picture. The software additionally checks, if the pins are straight respectively the balls are existent. These measures result in a higher output and a lower error rate.