Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has a 100:60 mix ratio by weight. It passes NASA low outgassing tests. It develops a high bonding strength of 1,800 psi at ambient temperatures and retains significant strength even upon exposure to temperatures as high as 400°F. The bonds produced are tough and durable as well as resistant to thermal cycling and many chemicals including water, fuels and many solvents. It has a service temperature range of 4K to 400°F. It adheres well to metals, glass, ceramics, wood, vulcanized rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and yet is a superior electrical insulator. Its thermal expansion coefficient is remarkably low. EP21TCHT-1 is widely used in electronics, electrical, chemical, aerospace and cryogenic applications. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where only slightly elevated temperature cures are possible. However, the best curing schedule to optimize properties is overnight at room temperature followed by 2 hours at 175-200°F.
