Master Bond

Electronic grade epoxy adhesive
max. 400 °F | Supreme 10HT/S Master Bond

Master Bond Supreme 10HT/S represents a breakthrough in conductive epoxy technology, featuring a combination of high performance properties including high shear and high peel strengths, low resistance, and exceptionally easy processing. This one component, no mix high purity silver conductive system is formulated to cure at elevated temperatures, e.g. 45 minutes at 275-300°F or 1 hour at 250°F. Minimum curing temperature is 250°F. Tensile shear strengths greater than 1,200 psi and T-peel strengths over 5 pli are readily obtained. Supreme 10HT/S produces its high performance bonds for service over the wide temperature range of 4K to 400°F, making it suitable for use in cryogenic applications. It offers superior resistance to high impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Supreme 10HT/S can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents, although it can be made thinner by adding 5 to 10% of acetone or xylene by weight.
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