Heat cure adhesive
EP3HTMED Master Bond

Master Bond Polymer System EP3HTMed represents a breakthrough in epoxy adhesive technology combining the ease of a one part, no mix, fast curing adhesive with high shear strength. This special formulation fully meets USP Class VI requirements. The one part EP3HTMed cures at elevated temperatures, e.g. 5-10 minutes at 300°F or 20-30 minutes at 250°F (minimum cure temperature is 250°F). EP3HTMed produces high strength bonds with lap shear strengths of 1,750 psi. Service temperature is -60°F to +400°F. It has superior resistance to impact, vibration and stress fatigue cracking while maintaining the moisture, creep and corrosion resistance typical of epoxy adhesives. It is 100% reactive and does not contain any diluents or solvents.

EP3HTMed possesses superior chemical resistance, particularly to chemical sterilants, as well as to other types of sterilization including ETO, radiation and autoclaving. The color of the EP3HTMed system is brown to tan. It bonds well to a wide variety of substrates including glass, metals, ceramics and most plastics. It can be readily used in the production of disposable and non-disposable medical devices as well as in medical electronics especially where high performance and speed of production are paramount