High strength epoxy adhesive
150 - 200 °F | EP30QF Master Bond

Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at elevated temperatures with a four to one mix ratio by weight. To optimize the properties, the recommended cure schedule is overnight at room temperature, followed by 1-2 hours at 150-200°F. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where high tensile modulus, outstanding compressive strength and superior dimensional stability are important requirements. Linear shrinkage after cure is exceptionally low. A lower viscosity version called EP30QFLV is also available.

Master Bond Polymer System EP30QF produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and many solvents. Its adhesion to both similar and dissimilar materials including metals, glass, ceramics and plastics is excellent. The adhesive’s electrical properties are particularly noteworthy, making it ideal for potting and encapsulation applications. The color of Parts A and B is tan. Master Bond Polymer System EP30QF is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.