Dimensionally stable adhesives

Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h

... Product Summary
EP54TC is a two-part, heat-cured epoxy formulated to provide high thermal conductivity while maintaining electrical insulation and low thermal resistance. It uses small particle fillers (5–30 μm) enabling very thin bond lines ...

... Key Features • Good physical strength properties • Low shrinkage upon curing • Cationic curing system, no oxygen inhibition • Passes NASA low outgassing tests Master Bond UV16 is a low viscosity, high strength epoxy based UV curable system for ...

... Key Features - Convenient handling and fast curing - Ideal for glob topping - Stellar electrical insulation properties - Withstands 1,000 hours 85°C/85% RH Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy ...

Master Bond LED405Med is a one part system that cures upon exposure to a 405 nm LED light without requiring a UV light source. It will cure without any oxygen inhibition. Its most special feature is that its main constituent is a nanofilled resin. This ...

... color. As mentioned above, this multifaceted system can be used as a glob top or die attach and in other applications as an adhesive or sealant in electronics when the special combination of properties, particularly the limited flow characteristics ...

... by weight or volume • Variable mix ratio feature allows adjusting the type of cure (mentioned above) • Easily applied; adhesive spreads smoothly; non-drip application feature • Ambient temperature cures or fast elevated temperature ...

... applications. It is a specialty formulation that can be used for bonding, coating, sealing and encapsulation. When used as an adhesive, the thermally conductive filler has very fine particle sizes; subsequently, it can be applied in sections ...

... ratio by weight. This adhesive is 100% reactive and does not contain any solvents or diluents. EP30 has outstanding physical strength properties along with highly reliable electrical insulation characteristics. This dimensionally ...

... temperature, followed by one to two hours of operation at a temperature between 150 and 200 degrees Fahrenheit. Note that the adhesive is 100% reactive and is not comprised of any volatiles or solvents, being recommended in situations ...

... Master bond's Super Gel 9 is a urethane modified epoxy that can be beneficial for a wide range of applications such as encapsulation of sensitive part of electronics and sealing visible components. This system is applicable in the industry of electronic, ...

Working temperature: -50 °C - 200 °C

Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster ...

Working temperature: -50 °C - 180 °C

Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster ...

Working temperature: -70 °C - 200 °C

... remarkable performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. Product Highlights Low ionic content Outstanding ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature. ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher temperatures. TUF ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical as well as thermal conductivity. ...