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... substrates • Optimum flow behavior for sealing and casting • Transparent dual cure adhesives available for large bonding areas Please note: We supply hightech adhesives exclusively to manufacturing ...
Working temperature: -55 °C - 150 °C
Shear strength: 18 N
DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: -55 °C - 150 °C
Shear strength: 8 N
DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...
Shenzhen DeepMaterial Technologies Co., Ltd
... protection and high efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. Used for LCD pin fixing.
Shenzhen DeepMaterial Technologies Co., Ltd
... efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. UV curing end face sealant suitable for LCD applications, ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: -55 °C - 150 °C
Shear strength: 4 N
... multi-purpose UV curing adhesive product line covers the main applications of structural bonding. The special formula of this product is suitable for the moisture-proof treatment of the COG or TAB installation terminal ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: -55 °C - 150 °C
Shear strength: 11 N
... The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. It is a unitized, UV-curable adhesive, specially designed for pin bonding applications ...
Shenzhen DeepMaterial Technologies Co., Ltd
Working temperature: 80 °C
Polymerization time: 5 min - 10 min
... selected for the glass transition temperature and modulus for the intended application. Classic low-temperature curing adhesive, used for LCD backlight module assembly.
Shenzhen DeepMaterial Technologies Co., Ltd
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