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... primary cure utilizing UV light along with a secondary heat curing mechanism. This system addresses the problem of curing areas on parts that do not allow UV light curing because of “shadowing” ...
Master Bond
Key Features - Low viscosity - Minimal shrinkage upon curing - Superb optical clarity - Cures at 80°C in shadowed out areas Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based ...
Master Bond
... NASA low outgassing specifications • Minimal shrinkage upon curing • Cures at 80°C in shadowed out areas Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure system. The secondary cure is ...
Master Bond
... impossible to cure adhesives simply by exposing them to light. In addition, the dual curing mechanisms are beneficial, especially when bonding components with shadowed areas. The combination ...
Working temperature: -55 °C - 135 °C
Shear strength: 21.5 N
... DeepMaterial multi-purpose UV curing adhesive is a one-component solvent-free product, which can be cured in a few seconds under UV or visible light. It has a fast curing speed, high ...
Shenzhen DeepMaterial Technologies Co., Ltd
... flexible and resilient two-part epoxy adhesive system. Due to its versatile and convenient working characteristics, it should be considered for any room temperature curing application where elevated temperature ...
... 140, manufactured by Epoxonic, is a 1-part adhesive equipped with a high glass transition temperature. It has an operating temperature that ranges from -40 °C up to +150 °C and density of 1.6 g/cm3. The adhesive ...
Dual-Cure electronic conformal coating and encapsulant technology represents the newest advancement in light/moisture cure technology. Dymax Dual-Cure conformal coatings and encapsulants for printed circuit ...
Working temperature: 150 °C
Epoxy Adhesives, Dual Pack, Packaging Quantity 5, Heat Resistance Temperature (Max) 150 °C • TE Internal Description: S1125-KIT-1 • Alias #: 7412607182 9-1196836-0 AC-J02557 S1125-KIT-1 • Packaging ...
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