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... Use our 850 nm photodiode arrays when you need to meet stringent specifications for high-speed data communications, with a choice of 1, 4, or 12 channels. These high-performance, high-reliability devices are engineered ...
... 4X200Gbps 500μm Die Pitch 1X4 Array Bottom-illuminated PIN PD Chip This 4X112GBaud Array 800Gbps photodiode chip, which is bottom-illuminated and mesa structure high data rate PIN photodiode ...
PHOGRAIN TECHNOLOGY（SHENZHEN） CO., LTD.
... The 8X56Gbaud (8X112Gbps PAM4) array light detector chip is a high-speed digital PIN light detector chip with a top entry light and a mesa structure, and the photosensitive zone size is Φ20μm. Characterized by high responsiveness, low ...
PHOGRAIN TECHNOLOGY（SHENZHEN） CO., LTD.
... The 4X56GBaud array 400Gbps light detector chip is a high-speed digital PIN light detector chip with top input light and mesa structure, and the photosensitive area size is Φ16μm. The main features of the product are high responsiveness, ...
PHOGRAIN TECHNOLOGY（SHENZHEN） CO., LTD.
... specifications
- Series: VTA2516H Series (16-channel photodiode array)
- Number of elements: 16 single-element photodiodes
- Pitch: 2.5 mm
- Substrate/PCB: FR-4, photodiodes
Excelitas Technologies - PCO
... ILLUMINATED PHOTODIODE ARRAYS CUSTOM PRODUCTS Share on FacebookTweet about this on TwitterShare on LinkedInEmail this to someone Backside illuminated (BSI) photodiode technology enables manufacturing ...
Detection Technology
... elements. The arrays can be configured to fit the customer’s requirement in terms of the number and size of the array elements. 8-, 12- or 16-element arrays in a 14-pin DIL package are also available ...
... OID7 6 p/n photodiode array chip General Description Optical device consisting of a 6 chip silicon P/N photodiode array with high uniformity for the output signals. The device gives ...
... consists of 6-chip photodiodes produced in planar technology. The photodiodes are passivated with silicon-nitride which acts as an antireflective layer. They are then bonded to the PCB and protected with transparent epoxy ...
... consists of 6-chip photodiodes produced in planar technology. The photodiodes are passivated with silicon-nitride which acts as an antireflective layer. They are then bonded to the PCB and protected with transparent epoxy ...
... consists of 6-chip photodiodes produced in planar technology. The photodiodes are passivated with silicon-nitride which acts as an antireflective layer. They are then bonded to the PCB and protected with transparent epoxy ...
... consists of 6-chip photodiodes produced in planar technology. The photodiodes are passivated with silicon-nitride which acts as an antireflective layer. They are then bonded to the PCB and protected with transparent epoxy ...
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