Wafer handling positioning systems

Repeatability: 1.5 µm - 3.5 µm
Load: 663 g
Stroke: 40 mm

... in the three lateral directions • Repeatability up to 1.5 µm The XYZ positioning system is a cartesian oriented positioning system consisting of three miniature linear ...

Repeatability: 2.3 µm - 4.5 µm
Load: 4.5 kg
Stroke: 50 µm - 50 µm

... compact 3-axis alignment system with screw drive and DC or stepper motor can be easily controlled using our FMC series controllers. With the appropriate commissioning software FMC Quick, the system ...

Repeatability: 5, 10 µm
Load: 4 kg - 25 kg
Speed: 0.1 m/s - 10 m/s

... repeatability, at even higher dynamics. With embedded support to proper sample alignment, the module then allows further control of wafers planarity, with respect to equipment heads, by means of its additional ...

Repeatability: 1.5, 5.5 µm
Stroke: 76 mm
Speed: 50 mm/s

... high-precision positioning system has been specifically designed as a complementary polarization filter for miniaturization and automation in EUV lithography. It maximizes the exposure quality as well ...

Repeatability: 1.5, 2.5 µm
Stroke: 50, 150 mm
Speed: 25 mm/s

XY theta alignment of UV exposure masks | High-precision positioning system for wafer exposure in dry nitrogen atmosphere Precision Assemblies 786001:002.26 XY theta ...

Repeatability: 1.5, 2.5 µm

... imaging in extremely dry environment • Specifically developed to maximize yield and resolution of wafer stepper systems • Simultaneous positioning of lenses to each other as well ...