エッジAIPC PN-Palladio-500-RPL-AIAIAI推論GPU
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特徴
- タイプ
- エッジAI, GPU, AI, AI推論
- 設定
- 組み込み
- プロセッサー
- Intel® Core i5, Intel® Core i7, Intel® Core i3, Intel® Core™ i9-13900
- ポート
- ディスプレイ ポート, RS-232, RS-485, RJ45, WiFi, 2.5 GbE, RS-422, USB3.2, Bluetooth, SATA III
- 探索システム
- Linux, Windows
- その他の特徴
- PoE, AIアクセラレーションモジュール搭載
- メモリ
- 32GB
詳細
Overview
Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics. The Palladio 500 RPL AI is a high-performance industrial workstation for edge AI and advanced graphics applications, designed for robust operation in industrial environments.
Highlights
Detailed specifications
CPU Description: 13th Gen Intel® Core™ Processors (Raptor Lake-P). Variants include Intel® Core™ i3-13100E (3.3–4.4 GHz, 4 cores, 8 threads, 60 W TDP); i3-13100TE (2.1–4.1 GHz, 4 cores, 8 threads, 35 W TDP); i5-13500E (2.4–4.6 GHz, 14 cores, 20 threads, 65 W TDP); i5-13500TE (1.3–4.5 GHz, 14 cores, 20 threads, 35 W TDP); i7-13700E (1.9–5.1 GHz, 16 cores, 24 threads, 65 W TDP); i7-13700TE (1.1–4.8 GHz, 16 cores, 24 threads, 35 W TDP); i9-13900E (1.8–5.2 GHz, 24 cores, 32 threads, 65 W TDP); i9-13900TE (1.0–5.0 GHz, 24 cores, 32 threads, 35 W TDP).
Graphics Description: Intel® Arc™ Pro B50 Graphics with 16 GB DDR6 VRAM. Support for up to four independent displays at up to 8K60.
Video Interfaces: 2x DisplayPort.
Video Resolution: Up to 4K @60 Hz (per specified outputs).
Memory Description: Up to 32 GB SO-DIMM DDR4 2666 (optional).
Mass Storage: 1x M.2 2280 (SATA); 1x M.2 2280 (PCIe Gen4 x4; SATA); 1x M.2 2280 (PCIe Gen4 x4) ; 2x SATA 2.5” drives (optional hot-swap).
Networking Description: Intel® embedded M.2 2230 802.11ac Wi‑Fi + BT 5.1 card with cables (optional); dual-band PIFA antenna (optional); 2x 2.5 GbE LAN (2x PoE optional).
USB Description: 6x USB 3.2 Gen 2 ports.
PCI Description: 1x mPCIe (PCIe x1; USB 2.0); 1x M.2 2230 E-key (PCIe x1; USB 2.0); 1x M.2 2280 M-key (PCIe Gen4 x4); 1x M.2 2280 M-key (PCIe Gen4 x4; SATA); 1x M.2 3042/3052/2280 B-key (PCIe x2; USB 2.0; USB 3.0; SATA); 1x PCIe Gen4 x16 or 2x PCIe Gen4 x8 (factory option).
Audio Description: 1x 3.5 mm audio.
Serial Ports: 2x COM RS-232/422/485 ports.
Other Interfaces: 5-pin terminal block power input (12–48 VDC); 2x ModBay expansion 7–9.5 mm (optional); 1x GPIO terminal block (DIO, CAN, Ext. Switch); 2x 3FF Micro-SIM; 1x power button; 1x external fan connector; optional 2x 2.5” hot-swap drives.
Security: PTT in BIOS; TPM (optional); Watchdog timer.
Power Supply: 12–48 VDC (20–48 VDC when configured with PCIe expansion 70W or above).
Operating System: Compatible with Linux, Windows.
Operating Temperature: -40 to 70°C (with 35W CPU); -40 to 50°C (with 65W CPU).
Dimensions: 240 x 143 x 267 mm.
Part number
PN-Palladio-500-RPL-AI
Caractéristiques / spécifications techniques
Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics. The Palladio 500 RPL AI is a high-performance industrial workstation for edge AI and advanced graphics applications, designed for robust operation in industrial environments.
Highlights
- CPU: 13th Gen Intel® Core™ i3/i5/i7/i9 Processors
- AI Accelerator: Intel® Arc™ Pro B50 powered AI acceleration (up to 170 INT8 TOPS)
- Memory: Up to 32 GB SO-DIMM DDR4 2666
- Connectivity: 2x 2.5 GbE LAN (2x PoE optional)
Detailed specifications
CPU Description: 13th Gen Intel® Core™ Processors (Raptor Lake-P). Variants include Intel® Core™ i3-13100E (3.3–4.4 GHz, 4 cores, 8 threads, 60 W TDP); i3-13100TE (2.1–4.1 GHz, 4 cores, 8 threads, 35 W TDP); i5-13500E (2.4–4.6 GHz, 14 cores, 20 threads, 65 W TDP); i5-13500TE (1.3–4.5 GHz, 14 cores, 20 threads, 35 W TDP); i7-13700E (1.9–5.1 GHz, 16 cores, 24 threads, 65 W TDP); i7-13700TE (1.1–4.8 GHz, 16 cores, 24 threads, 35 W TDP); i9-13900E (1.8–5.2 GHz, 24 cores, 32 threads, 65 W TDP); i9-13900TE (1.0–5.0 GHz, 24 cores, 32 threads, 35 W TDP).
Graphics Description: Intel® Arc™ Pro B50 Graphics with 16 GB DDR6 VRAM. Support for up to four independent displays at up to 8K60.
Video Interfaces: 2x DisplayPort.
Video Resolution: Up to 4K @60 Hz (per specified outputs).
Memory Description: Up to 32 GB SO-DIMM DDR4 2666 (optional).
Mass Storage: 1x M.2 2280 (SATA); 1x M.2 2280 (PCIe Gen4 x4; SATA); 1x M.2 2280 (PCIe Gen4 x4) ; 2x SATA 2.5” drives (optional hot-swap).
Networking Description: Intel® embedded M.2 2230 802.11ac Wi‑Fi + BT 5.1 card with cables (optional); dual-band PIFA antenna (optional); 2x 2.5 GbE LAN (2x PoE optional).
USB Description: 6x USB 3.2 Gen 2 ports.
PCI Description: 1x mPCIe (PCIe x1; USB 2.0); 1x M.2 2230 E-key (PCIe x1; USB 2.0); 1x M.2 2280 M-key (PCIe Gen4 x4); 1x M.2 2280 M-key (PCIe Gen4 x4; SATA); 1x M.2 3042/3052/2280 B-key (PCIe x2; USB 2.0; USB 3.0; SATA); 1x PCIe Gen4 x16 or 2x PCIe Gen4 x8 (factory option).
Audio Description: 1x 3.5 mm audio.
Serial Ports: 2x COM RS-232/422/485 ports.
Other Interfaces: 5-pin terminal block power input (12–48 VDC); 2x ModBay expansion 7–9.5 mm (optional); 1x GPIO terminal block (DIO, CAN, Ext. Switch); 2x 3FF Micro-SIM; 1x power button; 1x external fan connector; optional 2x 2.5” hot-swap drives.
Security: PTT in BIOS; TPM (optional); Watchdog timer.
Power Supply: 12–48 VDC (20–48 VDC when configured with PCIe expansion 70W or above).
Operating System: Compatible with Linux, Windows.
Operating Temperature: -40 to 70°C (with 35W CPU); -40 to 50°C (with 65W CPU).
Dimensions: 240 x 143 x 267 mm.
Part number
PN-Palladio-500-RPL-AI
Caractéristiques / spécifications techniques
- Modular fanless embedded PC for edge AI and graphics
- 13th Gen Intel® Core™ (Raptor Lake-P) processor family (i3/i5/i7/i9 options)
- Intel® Arc™ Pro B50 GPU with up to 16 GB DDR6 VRAM, up to 170 INT8 TOPS AI acceleration
- Up to 32 GB DDR4 SO-DIMM
- Multiple M.2 slots (PCIe Gen4 x4 and SATA) and optional 2x 2.5” hot-swap drives
- 2x DisplayPort, support up to 4 independent displays
- 2x 2.5 GbE LAN (PoE optional), optional Wi‑Fi 802.11ac + BT 5.1
- 6x USB 3.2 Gen 2, various M.2 and PCIe expansion options
- Operating range -40°C to 70°C (depending on CPU TDP)
- Power input 12–48 VDC (configurable for higher-power PCIe expansions)
- Dimensions: 240 x 143 x 267 mm
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