Data transmission wireless module PIC32WM-BZ6602CE

embeddedBluetooth

Overview
The PIC32WM-BZ6602CE is a highly integrated, wireless MCU module designed for scalable industrial, automotive and IoT applications. It combines a 128 MHz ARM® Cortex®-M4F core with multiprotocol radio, extensive peripherals and hardware security to simplify system design and speed development.

• Supports complex applications and future-proof designs with 2 MB Flash and 512 KB RAM
• Multiprotocol wireless: Bluetooth LE, Thread, Matter and proprietary 802.15.4 protocols
• Advanced peripherals including touch (CVD), graphics support, CAN FD, motor control and rich analog resources
• Built-in secure boot and hardware-based security engine to protect application and IP
• Regulatory-certified module with support for common development environments (MPLAB® and Zephyr®)

Key Features

• MCU: 128 MHz ARM® Cortex®-M4F core; 2 MB Flash; 512 KB RAM; 16-channel DMA; internal and external clock options
• Peripherals: 2x CAN FD ports; 2x 12-bit ADCs (9-channel, 1 Msps); 1x DAC (7-bit); Quadrature Encoder Interface (QEI) for motor control; up to 29 GPIOs; up to 6+1 SERCOM and QSPI; Low Cost Controllerless (LCC) graphics support; 4 motor-control PWM outputs; 8 CVD channels for touch
• Security: Immutable secure boot root-of-trust; AES-256, SHA-384, PKA/ECC hardware accelerators; True Random Number Generator (TRNG)
• Radio: Certified Bluetooth Core 6.0 support; 802.15.4 (Thread) and proprietary 802.15.4 support; hardware radio arbiter for coexistence; transmit power up to +11 dBm; receiver sensitivity to about −108/−109 dBm; secure over-the-air update support
• Certifications: FCC (USA), CE (EU), UKCA (UK), ISED (Canada)

Selected Documentation (titles)

• PIC32 BZ6 Family Data Sheet
• PIC32 BZ6 Programming Specification
• PIC32 BZ6 Family Silicon Errata
• Getting Started With Graphics on the PIC32CX BZ6 Wireless MCU (Application Note)
• Implementing Motor Control and Bluetooth LE Connectivity with a Single MCU (Application Note)
• Large-Scale Wireless Network Infrastructure (White Paper)
• Bluetooth Product Comparison Chart (Brochure)

Technical specifications

• Device Type: Module
• Wireless Technology: Bluetooth LE, Thread, Proprietary
• Bluetooth Spec: 6.0
• Thread Spec: 1.3.0
• CPU: 128 MHz, ARM Cortex-M4F
• Flash (KB): 2048
• SRAM (KB): 512
• GPIO: 29
• ADC Channels: 9
• DAC Channels: 1
• USB: None
• Motor Control PWM Outputs: 4
• Hardware Touch Peripheral: CVD (capacitive voltage divider)
• CAN: 2 (CAN FD)
• RX Sensitivity (dBm): -108 (listed up to -109 dBm in features)
• TX Output Power (dBm): 11 (max)
• Deep Sleep Current (μA): 0.08
• Antenna Type: Chip
• Secure Boot: Yes
• Encryption / Security Engines: Secure Boot, AES-256, SHA-384, PKA (RSA/ECC), TRNG
• Operating Temp (°C) Min: -40
• Operating Temp (°C) Max: 85
• Operating Voltage (V) Min: 1.9
• Operating Voltage (V) Max: 3.6
• Packages: 83-pin Module
• Package Size (mm): 11.5 x 14.3
• Ethernet: None (module supports other wired interfaces on companion dev boards)