OverviewHigh-temperature printing, reliable automation and full material flexibility for demanding industrial applications. Maximum performance with a 105‑liter heated build chamber designed for robust, high-performance parts and continuous production.
Key Benefits- Heated build chamber up to 100°C for thermal stability and dimensional accuracy
- Dual synchronized DSX extruders for complex geometries and continuous production (Relay Mode for filament backup)
- Nozzle temperatures up to 450°C enabling engineering-grade polymers
- Open Material System: compatible with BigRep filaments and third-party high-performance materials
- Automated calibration, adaptive mesh bed leveling and integrated sensors for reliable unattended operation
Features- Heated Build Chamber: 105‑liter chamber heated to 100°C for stable, accurate prints
- Dual DSX Extruders: synchronized, water-cooled dual DSX with integrated cooling and sensors; Relay Mode automatically switches when filament runs out
- High-Temp Material Compatibility: nozzle temperatures up to 450°C to print ABS, ASA, PC, PEKK‑A, PA12 CF and other engineering polymers
- Heated Print Bed: up to 140°C; options: tempered glass for dimensional accuracy or flexible PEI-coated steel plate for easy part removal
- Dry Material Storage: sealed keep-dry chamber with capacity for two filament spools to protect engineering-grade polymers from moisture
- Air Cleaning Unit: HEPA and activated carbon filters to reduce emissions
- Automation & Monitoring: HD wide-angle camera for remote visibility; continuous monitoring with integrated sensors and fast automated calibration
Applications- Large functional prototypes tested at real operating temperatures
- Small-series production and on-demand manufacturing of strong, lightweight end-use parts
- Jigs, fixtures and durable tooling for manufacturing
- Telecommunications outdoor cabinets and certified railway interior parts (PEKK‑A example)
- Medical applications with continuous fiber reinforcement (partner solutions)
MaterialsRecommended/supported materials include ABS, ASA, PC, PEKK‑A, BVOH, PC/ABS and PA12 CF. Compatible materials include PETG, PLA, PA6/66, TPU, PP and other filaments supported by the Open Material System.
Technical specifications- Build Volume: X 400, Y 600, Z 440 mm
- Build Chamber Temperature: up to 100°C (212°F)
- Print Bed Temperature: up to 140°C (284°F)
- Print Bed Surface: SWITCHPLATE (tempered glass or flexible PEI-coated steel plate options)
- Outer Dimensions: X 990, Y 1150, Z 1740 mm
- Weight: Approx. 400 kg
- Extruder: Direct Synchronized Extruder (DSX)
- Extruder Configurations: water-cooled Dual DSX
- Nozzle Temperature: up to 450°C (842°F)
- Nozzle Diameters: 0.4, 0.6, 1.0 mm
- Nozzle Type: Diamond
- Minimum Layer Height: 0.15 mm
- Maximum Throughput: 200 g/h
- Filament Diameter: 1.75 mm
- Out-of-Filament Detection: Yes
- Pause and Resume Print: Yes
- Backup Function (Relay Mode): Yes
- Adaptive Mesh Bed Leveling: Yes
- Automated Calibration: Yes (topology measurement and compensation)
- Material Storage: Keep‑Dry Chamber for filament protection
- Drive Technology: Stepper motors with encoders in an observed position control loop
- Maximum Movement Speed: XY 400 mm/s
- Position Accuracy: <0.05 mm
- Air Cleaning Unit: HEPA and activated carbon filters
- Power: 1P+N+PE, 208–240 V, 16 A, 50/60 Hz
- Certifications: CE, UL Ready