ALD deposition machine ALD 1200

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Overview
Experience the most innovative Atomic Layer Deposition system for optical coatings - the Leybold Optics ALD 1200. Plasma-Enhanced Spatial ALD for double-sided, ultra-uniform films on up to 8x ⌀300 mm substrates. The system delivers ultra-thin, dense, and stress-controlled coatings on micro-structured and curved 3D substrates – double-sided in a single pass. With high deposition rates on 8 substrates of up to 300 mm, process temperatures from 50–230°C, and fully customizable wafer handling solutions, it combines best‑in‑class conformality with semiconductor‑grade throughput and cleanliness.

Key Benefits

• Precision on every surface: Ultra-thin conformal coatings on nano-structured and curved 3D substrates
• Optimized for High Throughput: Spatial separation of gases increases growth rates; multi-wafer production in a single run
• Tailored to your needs: Double-sided coatings without flipping, reducing cycle time and particle risk
• Material agility: High material flexibility with efficient precursor utilization for cost‑effective scaling
• In-situ optical monitoring: OMS 6000 closed-loop control for complex multilayer stacks with repeatable results
• Full fab integration: SMIF and FOUP automated wafer handling; SEMI S2/S8 compliant; SECS:GEM compatible

Highlight features

• High deposition rates of up to 0.5 nm/s on 8 substrates
• Scalable formats up to 300 mm substrate sizes; non-uniformities < ±1.0% on 300 mm
• High conformality and stress-neutral coatings
• Plasma-assisted low deposition temperature < 100°C for temperature-sensitive substrates
• Support for up to 4 different precursors
• Fab-ready cleanliness with low particle levels tailored for precision optics and semiconductor lines
• In-situ optical monitoring system OMS 6000

Applications
The ALD 1200 is ideal for applications requiring ultra-uniform, pinhole-free coatings on complex structures or 3D substrates such as highly curved lenses and structures with high aspect ratio. Typical application areas include:

• Semiconductor manufacturing (hard masks, trench filling, gate oxides, encapsulation)
• Precision optics and photonic integration (PICs, metasurfaces, diffractive optical elements)
• Sensing (proximity sensors, hyperspectral imaging, LiDAR, CIS)
• Lighting and display (LED, microLED, VCSEL, OLED)
• Life science (microscopy, endoscopy)
• Consumer optics (smartphone and camera lenses, AR glasses)

Coating processes

• Filters
• Mirrors
• AR coatings
• Trench filling
• Barrier coatings
• Gate oxides

Materials (examples)

• SiO2 and various oxide materials
• TCO material group and other materials on demand

FAQ — Good to know

• When to use ALD? When optical quality, barrier integrity and 3D uniformity are critical. Plasma-enhanced spatial ALD produces dense, stress-neutral films at low temperatures with precise and repeatable layer control.
• How does spatial ALD work? Spatial ALD deposits thin films by repeating self-limiting surface reactions: precursors chemisorb onto the substrate, are modified in the plasma zone, and deposit layer-by-layer for precise thickness control and conformal coverage.
• Benefits vs sputtering/evaporation: ALD provides superior conformality, pinhole-free films and stress control on complex 3D substrates.

Caractéristiques / spécifications techniques

• Model: ALD 1200 (Leybold Optics)
• Deposition method: Plasma-Enhanced Spatial ALD, plasma-assisted, double-sided in single pass
• Substrate capacity: multi-wafer (up to 8 substrates)
• Maximum substrate size supported: Ø 300 mm
• Deposition rate: up to 0.5 nm/s on 8 substrates
• Process temperature range: 50–230°C; plasma-assisted low-temperature option < 100°C for temperature-sensitive substrates
• Thickness uniformity: non-uniformities < ±1.0% on 300 mm (typical)
• Precursors: support for up to 4 different precursors
• Control: In-situ optical monitoring OMS 6000 for closed-loop control of multilayer stacks
• Cleanliness: fab-ready cleanliness with low particle levels tailored for precision optics and semiconductor lines
• Integration: SMIF and FOUP automated wafer handling; SEMI S2/S8 compliant; SECS:GEM compatible
• Targeted applications: semiconductor devices, precision optics, photonic integration, sensing, lighting/display, life science, consumer optics