Thick-film resistor MP725 series

high-powerSMD

• Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pads to receive aluminum wire bonds. • Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. • Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%, and 0.10 ohm at ±1%. • Low inductance provides excellent high frequency and pulse response. • High pulse handling and overload capability. • Best choice for switching power supplies, motor speed controls, and high current sensing applications.