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Box PC DS-1401
embeddedwall-mounted12th Generation Intel® Core™

Box PC - DS-1401 - Cincoze Co., Ltd. - embedded / wall-mounted / 12th Generation Intel® Core™
Box PC - DS-1401 - Cincoze Co., Ltd. - embedded / wall-mounted / 12th Generation Intel® Core™
Box PC - DS-1401 - Cincoze Co., Ltd. - embedded / wall-mounted / 12th Generation Intel® Core™ - image - 2
Box PC - DS-1401 - Cincoze Co., Ltd. - embedded / wall-mounted / 12th Generation Intel® Core™ - image - 3
Box PC - DS-1401 - Cincoze Co., Ltd. - embedded / wall-mounted / 12th Generation Intel® Core™ - image - 4
Box PC - DS-1401 - Cincoze Co., Ltd. - embedded / wall-mounted / 12th Generation Intel® Core™ - image - 5
Box PC - DS-1401 - Cincoze Co., Ltd. - embedded / wall-mounted / 12th Generation Intel® Core™ - image - 6
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Characteristics

Type
box
Configuration
embedded, wall-mounted
Processor
12th Generation Intel® Core™, 13th Generation Intel® Core™, 14th Generation Intel® Core™
Ports
VGA, HDMI, USB 2.0, RS-232, RS-485, RJ45, RS-422, SIM card, USB 3.2, Mini PCIe, M.2, SATA, mSATA, PCI Express, PCI, NVMe, M.2 Key M
Operating system
Linux® Ubuntu™, Windows 10, Windows 11
Motherboard format
ATX
Domain
industrial
Protection level
rugged, MIL-STD-810G
Other characteristics
fanless, modular, PoE, EN50155
Memory
96 GB

Description

Overview
The DS-1400 Series is a rugged, modular embedded computer family designed for industrial, manufacturing and railway applications. It supports Intel® BTL‑S / 14th, 13th and 12th Gen processors, offers wide operating conditions and modular expansion for field-deployable edge computing.

Product features
  • Processor support: Intel® Bartlett Lake‑S / Raptor Lake‑S Refresh / Raptor Lake‑S / Alder Lake‑S (up to 65 W TDP).
  • Memory: 2 x DDR5 SO‑DIMM sockets, ECC/non‑ECC, up to 96 GB, up to 5600 MHz (CPU dependent).
  • Storage: 2 x 2.5" SATA (one front hot‑swap), 3 x mSATA (shared with Mini‑PCIe), 1 x M.2 Key M (NVMe/SATA); RAID 0/1/5/10 supported.
  • Networking & I/O: 2 x GbE (Intel® I219 + I210) standard, optional 2 x 10GbE via modules; up to 6 x USB 3.x, 2 x USB 2.0, 2 x RS‑232/422/485, 2 x SIM, audio, PS/2.
  • Expansion: Up to 2 x PCI/PCIe slots (GPU support with riser and aux power up to 130 W on DS‑1402); optional CMI/CFM/MEC modules for LAN, CAN, PoE, IGN and other I/O.
  • Environmental & power: Wide temp operation (-40°C to 70°C depending on CPU/TDP), wide input 9–48 VDC, fanless unibody design, MIL‑STD‑810G qualified.

Certifications
  • EN 50121‑3‑2 (railway EMC)
  • MIL‑STD‑810G
  • EN 62368‑1
  • CB, UL / cUL
  • CE / UKCA / FCC / ICES

Key platform capabilities
  • Processing & AI: Supports up to 24 cores (hybrid CPU options) with integrated Intel® UHD graphics (UHD 770/730/710) for accelerated image processing and inference; compatible with Intel® OpenVINO™ Dev Kit and Edge Insights for AMR.
  • Modular I/O: Multiple Mini‑PCIe slots, CMI/CFM interfaces and configurable I/O for field customization and retrofit projects.
  • PCI/PCIe add‑ons: Dual expansion slots (model dependent) with patented adjustable card retainer (Patent No. I773359) to secure cards in high‑vibration environments.
  • Reliability features: Reverse power protection, over‑voltage/current protection, SuperCap CMOS maintenance‑free backup, instant reboot (0.2 s), software watchdog.

Technical specifications
  • Models: DS‑1400 / DS‑1401 / DS‑1402 (varies by PCIe slot count and chassis height).
  • Chipset: Intel R680E.
  • Graphics: Integrated Intel® UHD Graphics (varies by CPU).
  • Display outputs: VGA, 2 x DisplayPort, HDMI (quad independent displays supported).
  • Serial & USB: 2 x RS‑232/422/485 (DB9), USB 3.2 Gen2 x2, USB 3.2 Gen1 x4, USB 2.0 x2.
  • Expansion details: DS‑1400/1401: 1 x PCI/PCIe (up to 235 x 124 mm, GPU up to 75 W); DS‑1402: 2 x PCI/PCIe (GPU up to 130 W with riser/aux power).
  • Power: 9–48 VDC input via terminal block; AT/ATX mode; remote power on/off.
  • Dimensions (W x D x H): 227 x 261 x 88 / 108 / 128 mm. Weights ~4.5–5.44 kg.
  • Operating systems: Windows 11/10, Ubuntu Desktop 22.04 LTS.
  • Environment: Storage -40°C to 85°C; relative humidity up to 95% RH @70°C non‑condensing.

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Rugged Embedded Computers

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