Box PC DS-1102

embeddedwall-mountedIntel® Core™ i7-6700TE

Overview
Cincoze DS-1100 Series is a fanless, rugged embedded computer platform based on 7th/6th generation Intel® Core™/Xeon® socket CPUs (LGA1151). Designed for industrial, transportation and edge applications, the series offers modular CMI/CFM expansion, rich I/O, optional M12 connectors, RAID 0/1 storage, Instant Reboot and an integrated SuperCap for maintenance-free CMOS. It supports up to 2 PCI/PCIe expansion slots (model dependent), up to 64 GB DDR4, wide 9–48 VDC input and a wide operating temperature range depending on CPU and configuration.

Product Features

• Socket support for 7th & 6th Gen Intel® Core™ / Xeon® (LGA1151)
• 2x DDR4 SO‑DIMM sockets, 2133/2400 MHz, up to 64 GB
• Triple independent displays: 1x DVI‑I, 2x DisplayPort
• 2x 2.5" SATA HDD/SSD bays (Gen3) with RAID 0/1
• Up to 2x PCI/PCIe expansion slots (model dependent)
• CMI & CFM modular interfaces for PoE, IGN, extra LAN, isolated COM/DIO modules
• 3x full‑size Mini‑PCIe slots and 1x SIM socket for wireless expansion
• Wide DC input (9–48 V), AT/ATX support and remote power/reset terminals
• High shock & vibration tolerance, wide operating temperature range and industrial certifications

Technical specifications

• Processor: Supports 7th Gen (Kaby Lake‑S) & 6th Gen (Skylake‑S) Intel® Core™/Xeon® LGA1151 desktop CPUs (various i7/i5/i3, Pentium®, Celeron®; 35W–65W options)
• Chipset: Intel Q170; BIOS: AMI 16 Mbit SPI
• Memory: 2x DDR4 SO‑DIMM (unbuffered non‑ECC), 2133/2400 MHz, up to 64 GB
• Graphics: Intel® HD Graphics, triple independent display (1x DVI‑I, 2x DP), DP up to 3840x2160 (CPU dependent)
• LAN: 2x GbE (Intel I219‑LM, I210) with WoL, Teaming, Jumbo Frame, PXE
• Serial: 2x RS‑232/422/485 (DB9) with auto flow control, selectable 5V/12V; optically/electrically isolated options via modules
• USB & Audio: 6x USB 3.2 Gen1 Type‑A, 2x USB 2.0; Line‑out & Mic‑in (3.5 mm)
• Storage: 2x 2.5" SATA bays (Gen3) + 3x mSATA (shared with Mini‑PCIe); RAID 0/1 support
• Expansion: 2x CMI interfaces, 1x CFM interface, up to 2x PCI/PCIe slots (model dependent), 3x full‑size Mini‑PCIe
• Power & Protection: AT/ATX, 9–48 VDC input, reverse/over‑voltage/over‑current protection; SuperCap for CMOS
• Dimensions & Weight: DS‑1100: 227×261×88 mm (~4.7 kg); DS‑1101: 227×261×108 mm (~5.22 kg); DS‑1102: 227×261×128 mm (~5.7 kg)
• Operating Temperature: depends on CPU/TDP (examples: -40°C to 50/70°C for specific 35W/51–65W configurations)
• Certifications: CE, UKCA, FCC, EN 50121‑3‑2, LVD EN62368‑1, E‑Mark, CISPR32 Class A
• Available models: DS‑1100, DS‑1101, DS‑1102 (e.g., DS‑1100‑R20, DS‑1101‑R20, DS‑1102‑R20)