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Box PC DS-1301
embeddedwall-mountedIntel® Core™ i7-10700TE

Box PC - DS-1301 - Cincoze Co., Ltd. - embedded / wall-mounted / Intel® Core™ i7-10700TE
Box PC - DS-1301 - Cincoze Co., Ltd. - embedded / wall-mounted / Intel® Core™ i7-10700TE
Box PC - DS-1301 - Cincoze Co., Ltd. - embedded / wall-mounted / Intel® Core™ i7-10700TE - image - 2
Box PC - DS-1301 - Cincoze Co., Ltd. - embedded / wall-mounted / Intel® Core™ i7-10700TE - image - 3
Box PC - DS-1301 - Cincoze Co., Ltd. - embedded / wall-mounted / Intel® Core™ i7-10700TE - image - 4
Box PC - DS-1301 - Cincoze Co., Ltd. - embedded / wall-mounted / Intel® Core™ i7-10700TE - image - 5
Box PC - DS-1301 - Cincoze Co., Ltd. - embedded / wall-mounted / Intel® Core™ i7-10700TE - image - 6
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Characteristics

Type
box
Configuration
embedded, wall-mounted
Processor
Intel® Core™ i5-10500TE, Intel® Xeon® W-1270TE, Intel® Xeon® W-1290TE, Intel® Xeon® W-1250TE, Intel® Xeon® W-1250E, Intel® Xeon® W-1270E, Intel® Core™ i5-10500E, Intel® Core™ i9-10900TE, Intel® Core™ i7-10700TE, Intel® Core™ i3-10100TE, Intel® Core™ i3-10100E, Intel® Core™ i9-10900E, Intel® Core™ i7-10700E
Ports
RS-485, VGA, HDMI, DisplayPort, USB 2.0, RS-232, RS-422, PCI Express, USB 3.2, SATA, mSATA, NVMe, M.2 Key M
Operating system
Linux, Windows 10
Motherboard format
ATX
Domain
industrial, automation, for rolling stock
Other characteristics
fanless, SSD, modular, EN50155
Memory
64 GB

Description

Overview
The DS-1300 Series is a powerful embedded computer delivering unrivalled performance, versatile functionality and rich industrial I/O. It features dual PCI/PCIe expansion capability and supports Cincoze modular expansion (CMI, CFM, MEC) for additional I/O or functions. It is designed to meet industrial environment requirements and certifications, delivering reliable performance for factory automation, industrial automation and rolling stock applications.

Product Highlights
  • 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max up to 80 W TDP)
  • 2x GbE LAN standard and optional 2x 10GbE LAN via modules
  • 2x 2.5" SATA storage bays, 3x mSATA sockets, 1x M.2 Key M for NVMe SSD
  • Up to 2x PCI/PCIe expansion slots (with optional riser cards)
  • 3x full-size Mini PCIe sockets and 2x SIM card slots
  • Optional CMI modules for I/O expansion and optional CFM modules for ignition sensing & PoE
  • Wide operating temperature range from -40°C to 70°C (depending on CPU TDP and configuration)
  • Meets MIL-STD-810G and EN50155 (EN 50121-3-2 only) standards

Key Features & Capabilities
  • Workstation-grade 10th-gen Intel® Xeon® or Core™ CPUs up to 10 cores; supports up to 80W TDP Xeon processors
  • DDR4 SO-DIMM support: 2x DDR4 2933/2666/2400 (up to 64 GB; Xeon/i9/i7 up to 2933 MHz)
  • Integrated Intel® UHD-630 graphics supporting triple independent displays (HDMI, 2x DisplayPort, VGA)
  • Extensive I/O: up to 6x USB 3.x, 2x USB 2.0, 2x RS-232/422/485, 2x GbE, optional high-speed LAN via CMI modules
  • Storage: 2x 2.5" SATA (one front accessible, one internal), 3x mSATA (shared with Mini-PCIe), 1x M.2 Key M (2280) supporting PCIe x4 NVMe or SATA
  • Expansion: flexible PCI/PCIe add-on card support (single or dual slot variants), adjustable card retainers to secure cards in high-vibration environments
  • Power: 9–48 VDC input via 3-pin terminal block; AT/ATX mode switch; remote power On/Off; total power budget 180W
  • Other functions: external fan connector with smart fan support, clear CMOS switch, reset button, instant reboot technology (0.2s), software-programmable watchdog timer

Certifications
  • EN 50121-3-2 (rolling stock related feature), EN 62368-1, CB, UL
  • CE, UKCA, FCC, ICES-003 Class A

Embedded Video
Product video is available demonstrating DS-1300 Series capabilities and expandability.

Ordering & Model Notes
Available main models include DS-1300-R10 (base series), DS-1301-R10 (with 1x PCI/PCIe expansion slot) and DS-1302-R10 (with 2x PCI/PCIe expansion slots). A wide range of optional CMI/CFM/MEC modules, riser cards, fan kits, brackets and power adapters are available to configure the system for target applications.

Technical Specifications
  • Model family: DS-1300 Series (variants: DS-1300 / DS-1301 / DS-1302)
  • Processors supported: Intel® Xeon® W series (80W/35W variants); Intel® Core™ series (i9/i7/i5/i3 in 65W/35W variants). Examples: Xeon W-1270E, W-1250E, W-1290TE; Core i9-10900E, i7-10700E, i5-10500E, i3-10100E, and their TE variants.
  • Chipset: Intel® W480E
  • Memory: 2x DDR4 SO-DIMM 2933/2666/2400; up to 64 GB; unbuffered, non-ECC
  • Graphics: Integrated Intel® UHD-630; triple independent displays; HDMI 1x (4096×2160@30Hz), DP 2x (verified max 3840×2160), VGA 1x (1920×1200@60Hz)
  • Audio: Realtek® ALC888 HD Audio; 1x Line-out (3.5mm), 1x Mic-in (3.5mm)
  • LAN: 2x GbE RJ45 (GbE1 Intel I219, GbE2 Intel I210); optional CMI modules for additional GbE / 2.5GbE / 10GbE
  • COM ports: 2x RS-232/422/485 with auto flow control (DB9) supporting 5V/12V
  • USB: 2x USB 3.2 Gen2 (10Gbps, Type A), 4x USB 3.2 Gen1 (5Gbps, Type A), 2x USB 2.0 (480Mbps)
  • PS/2: 1x PS/2 6-pin mini-DIN
  • Storage: 1x front-accessible 2.5" SATA Bay (SATA 3.0), 1x internal 2.5" SATA Bay (SATA 3.0)
  • mSATA: 3x mSATA sockets (SATA 3.0, shared by Mini-PCIe)
  • M.2: 1x M.2 Key M (2280) supporting PCIe x4 NVMe or SATA (SATA 3.0)
  • RAID: Supports RAID 0/1/5/10
  • Expansion slots: DS-1300: 0–1 PCI/PCIe with optional riser; DS-1301: 1x PCI/PCIe; DS-1302: 2x PCI/PCIe (supported add-on card max size example: up to 235 x 124 mm per card in some configs; combined card power up to ~110 W in some configs)
  • Mini-PCIe: 3x full-size Mini-PCIe sockets
  • SIM: 2x SIM sockets
  • CMI interface: 2x high-speed CMI and 2x low-speed CMI for optional CMI modules
  • CFM interface: 1x CFM IGN interface for optional CFM-IGN module
  • External fan: 1x 4-pin terminal block (supports smart fan control via BIOS)
  • Power ignition sensing: Supported via optional CFM module with selectable 12V/24V and delay time management
  • Front controls: 1x ATX On/Off button, AT/ATX mode switch, reset button, clear CMOS switch
  • Remote power: Remote Power On/Off (2-pin terminal block) and Remote Power LED (2-pin terminal block)
  • Power input: 9–48 VDC via 3-pin terminal block
  • Total power budget: 180W (system)
  • Protection & reliability: Reverse power input protection; over-voltage protection (51–58V range, shutdown & auto-recover); over-current protection 15A; SuperCap for CMOS (maintenance-free); MTBF ~371,393 hours (Telcordia SR-332, Method 1, Case 3)
  • Operating temperature: With 35W TDP processors: -40°C to 70°C; With 58–65W TDP processors: -40°C to 50°C (with external fan kit); With 80W TDP processors: -40°C to 40°C (with external fan kit)
  • Storage temperature: -40°C to 85°C
  • Relative humidity: 95% RH @ 70°C (non-condensing)
  • Ingress protection: IP30 compliant (per IEC60529)
  • Shock & Vibration: MIL-STD-810G
  • EMC/EMI/EMS: CE, UKCA, FCC, ICES-003 Class A; CISPR32 Class A; EN/BS EN 50121-3-2 (conducted & radiated Class A); EN/IEC 61000-x family compliance
  • Safety standards: UL, cUL, CB, IEC, EN 62368-1
  • Mechanical: Extruded aluminum unibody; fanless, cableless, jumper-less design; wall mount. Dimensions (W x D x H): DS-1300: 227 x 261 x 88 mm; DS-1301: 227 x 261 x 108 mm; DS-1302: 227 x 261 x 128 mm
  • Weight: DS-1300: ~4.5 kg; DS-1301: ~5.04 kg; DS-1302: ~5.4 kg
  • Operating systems: Windows® 10 supported; Linux supported by project
  • Included items: System x1, heatsink pack x1, wall mount kit x1, screw pack x1, terminal block connectors as listed

Catalogs

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