Box PC DS-1302

embeddedwall-mountedIntel® Core™ i7-10700TE

Overview
The DS-1300 Series is an industrial fanless embedded computer based on 10th-generation Intel® Xeon® and Core™ processors. It delivers workstation-class CPU options, extensive industrial I/O and modular Cincoze CMI/CFM expansion, plus up to 2x PCI/PCIe expansion slots for add-on cards. The platform is designed and certified for factory automation, industrial control and rolling-stock applications.

Product Features

• Workstation-grade 10th-gen Intel® Xeon® W-series and Core™ CPUs (up to 10 cores; Xeon up to 80 W TDP)
• Standard 2x GbE LAN; optional 2x 10GbE via modules
• Storage: 2x 2.5" SATA bays, 3x mSATA sockets, 1x M.2 Key M (NVMe/SATA)
• Up to 2x PCI/PCIe expansion slots (with optional riser cards) supporting full-size add-on cards
• 3x full-size Mini PCIe sockets and 2x SIM card slots
• Cincoze CMI/CFM modular interfaces for additional I/O, PoE or ignition sensing
• Wide operating temperature range depending on CPU/TDP; fanless, cableless unibody mechanical design
• Compliant with MIL-STD-810G and rolling-stock standard EN 50121-3-2 (where applicable)

Certifications

• EN 50121-3-2
• EN 62368-1
• CB
• UL / cUL

Models / Ordering
Model Name: DS-1300 / DS-1301 / DS-1302
DS-1300-R10: Base configuration with 10th-gen Intel® Xeon®/Core™ options, modular expansion and standard I/O
DS-1301-R10: DS-1300 platform with 1x PCI/PCIe expansion slot
DS-1302-R10: DS-1300 platform with 2x PCI/PCIe expansion slots

Highlights

• Chipset: Intel® W480E
• Memory: 2x DDR4 SO-DIMM (2933/2666/2400 MHz), up to 64 GB (unbuffered, non-ECC)
• Graphics: Integrated Intel® UHD-630; supports up to triple independent displays (HDMI, 2x DisplayPort, VGA)
• I/O: USB 3.2 Gen2/Gen1, USB 2.0, 2x RS-232/422/485 (DB9), PS/2, audio
• Expansion and modularity: 2x High-Speed CMI, 2x Low-Speed CMI, 1x CFM IGN interface; 3x full-size Mini-PCIe
• Power: 9–48 VDC input (3-pin terminal block), AT/ATX mode, total power budget ~180W
• Physical: Dimensions vary by model (227 x 261 x 88 / 108 / 128 mm), extruded aluminum chassis, wall-mountable, IP30
• Reliability: Reverse power protection, over-voltage/over-current protections, SuperCap CMOS, MTBF ~371,393 hours
• Environment: Operating temp depends on CPU/TDP (examples: 35W: -40°C to 70°C; 58–65W: -40°C to 50°C with fan kit; 80W: -40°C to 40°C with fan kit)

Included / Package Checklist (summary)

• DS-1300 Series embedded system x1
• Heatsink pack x1
• Wall mount kit x1
• Screw pack x1
• Remote function terminal block connector x2
• Power terminal block connector x1
• Fan terminal block connector x1

Technical specifications

• CPU options: Intel® Xeon® W-series and Intel® Core™ series (various TDP variants up to 80W)
• Chipset: Intel® W480E
• Memory: 2x DDR4 SO-DIMM, up to 64 GB
• Storage: 2x 2.5" SATA, 3x mSATA, 1x M.2 Key M (2280) for NVMe/SATA; RAID 0/1/5/10 supported
• LAN: 2x GbE standard; additional via CMI modules (including 10GbE options)
• Expansion: Up to 2x PCI/PCIe slots with riser cards; 3x Mini-PCIe; CMI/CFM interfaces
• Compliance: EN 62368-1, EN 50121-3-2 (rolling stock), CB, UL, CE/UKCA, FCC, ICES-003 Class A
• Mechanical: Fanless, cableless unibody, wall-mount, IP30; dimensions per model as listed above