Semi-automatic mask aligner EVG®610

for wafers

The EVG®610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm. The EVG610 supports a variety of standard lithography processes, such as vacuum-, hard-, soft-, and proximity exposure modes, with the option of back-side alignment. Moreover the system offers additional capabilities including bond alignment and nanoimprint lithography (NIL). The EVG610 offers quick processing and re-tooling for changing user requirements with a conversion time of less than a few minutes. Its advanced multi-user concept can be adapted from beginners to expert level, thus making it ideal for universities and R&D applications Features Wafer/substrate size from pieces up to 200 mm/8’’ Top-side and bottom-side alignment capability High-precision alignment stage Automated wedge compensation sequence Motorized and recipe-controlled exposure gap Supports the latest UV-LED technology Minimized system footprint and facility requirements Step-by-step process guidance Remote tech support Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages) Agile processing and conversion re-tooling Table top or stand-alone version with anti-vibration granite table Additional capabilities: Bond alignment IR alignment Nanoimprint lithography (NIL)