Multi-channel manifold

for temperature control circuitsdistributionmodular

Product overview
Modular underfloor manifold system for liquid cooling distribution in data centers and edge facilities. Routes cooling piping beneath raised access floors to form a dedicated underfloor plenum, enabling phased expansion and minimizing on-site disruption during installation and retrofits.

Key features

• Modular manifold architecture designed for installation beneath raised access floors
• Routing of cooling piping inside an underfloor plenum to separate cooling circuits from power and data cabling
• Quick-install modules that reduce on-site civil works and downtime
• Supports clear physical segregation of cooling lines, power lines and data transmission cables

Benefits

• Improved cable and piping management with reduced interference risk
• Enhanced operational safety through physical separation of systems
• Ease of maintenance and servicing with minimal impact on daily operations
• Scalable design to accommodate increasing server density and cooling demand

Integration and scalability
Integrates with raised access floor constructions to create an exclusive underfloor plenum that simplifies routine access and maintenance. The modular approach allows incremental capacity increases without major disruptions, making it suitable for new builds and retrofits in environments sensitive to operational downtime.

Technical specifications

• Product type: Underfloor liquid cooling manifold system (modular distribution)
• Application: Data center and edge cooling — new construction and retrofit
• Installation location: Beneath raised access floors (underfloor plenum)
• Architecture: Modular design for rapid installation and easy expansion
• Primary benefits: Physical separation of cooling and cabling, improved cable management, reduced interference, enhanced safety
• Maintenance: Designed for routine access with minimal operational disruption
• Brand: EXTRCOOL