Multi-channel manifold

servermodular

Overview
Integrated underfloor manifold systems route cooling piping beneath raised access flooring to provide liquid cooling distribution for data center environments. These modular solutions are suitable for both new data center construction and retrofits, enabling expansion of cooling capacity with minimal on-site disruption.

Benefits

• Minimizes on-site construction disruption and enables quick, straightforward installation.
• Provides clear physical separation from power and data cabling layouts for neater cable management and reduced interference risk.
• Enhances system safety and operational clarity by isolating cooling pipelines from other infrastructure.

Design and Installation
Underfloor manifolds are designed to integrate with raised access floor structures to form a dedicated underfloor plenum. This arrangement eases routine access and maintenance while supporting long-term, scalable development of data center cooling infrastructure. The modular design supports straightforward expansion as server density and cooling demand grow.

Maintenance and Scalability
The underfloor layout enables liquid cooling systems to be serviced and maintained with minimal impact on daily operations. The design facilitates clear isolation between cooling pipelines, power lines and data transmission cabling, and supports incremental capacity increases to meet rising cooling requirements.

Applications
Ideal for data centers, edge computing facilities and other IT environments where compact, reliable liquid cooling distribution is required, including both new builds and retrofit projects that demand rapid deployment and minimal operational interruption.

Technical specifications

• Placement: Under raised access flooring (underfloor plenum integration).
• Type: Modular underfloor liquid cooling manifold system.
• Installation: Quick installation with minimal on-site construction disruption; suitable for retrofits and new construction.
• Benefits: Physical separation from power and data cabling, improved cable management, reduced interference risk, enhanced system safety.
• Scalability: Designed to support scalable growth of data center cooling capacity and server density.
• Maintenance: Enables servicing with minimal operational impact.