OverviewFloor-supported and hybrid liquid cooling manifold configurations provide flexible on-site adaptation for complex data center layouts. These engineered solutions support combinations of in-rack installation, underfloor routing and custom pipeline layouts while preserving operational performance, scalability and maintenance access.
Product highlights- Workload-specific engineering Configurations tailored to match required power density and cooling load.
- Compatibility with existing HAC systems Designed to integrate with hot-aisle containment deployments without major overhauls.
- Hot-aisle liquid cooling integration Optimized for manifold installation directly within the hot aisle to simplify distribution.
- Phased deployment Modular design enables incremental capacity expansion aligned with facility growth.
From air to liquid — on your timelinePre-engineered modular components simplify liquid-cooling retrofits, address structural slab load constraints and accelerate on-site deployment, minimizing disruption to operations.
Technical specifications- Type: Floor-supported and hybrid liquid cooling manifold configurations (custom layouts)
- Supported installations: In-rack, underfloor routing, hot-aisle integration and custom pipeline routing
- Design: Modular, scalable and service-accessible for phased deployment
- Compatibility: Engineered for integration with hot-aisle containment (HAC) and existing cooling systems
- Applications: Data centers, GPU clusters and server cooling
- Brand: EXTRCOOL