Temperature control circuit manifold

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Enabling Liquid Cooling for Retrofit and New Builds
EXTRCOOL's Liquid Cooling Manifolds are key to implementing liquid cooling in high-density data centers, efficiently transferring chilled coolant from the Coolant Distribution Unit (CDU) directly to server racks. They precisely regulate flow rate, pressure, and temperature to ensure uniform heat dissipation across all servers, effectively eliminating hotspots that often plague high-density setups. This precise control boosts cooling efficiency and server performance while minimizing overheating-related downtime.

Product Details
Each EXTRCOOL manifold is manufactured in-house to strict industry standards, featuring precision welding for structural integrity, rigorous pressure testing to prevent leaks, and cleanliness verification to avoid contaminating the cooling system. Every unit is accompanied by full lifecycle documentation, enabling complete traceability from production and factory testing to on-site installation. EXTRCOOL manifolds integrate seamlessly with existing data center cooling infrastructure, including Hot Aisle Containment (HAC) systems, and fully support flexible hybrid air-and-liquid deployments. They are designed for easy on-site installation and global scalability, providing a future-ready foundation that adapts to growing computing demands.

Product Highlights

• Seamlessly integrates with Hot Aisle Containment (HAC) and ceiling systems, ensuring compatibility with existing infrastructure.
• Offers pre-integration capabilities to simplify on-site deployment, reducing installation time and complexity.
• Works with a wide variety of cooling liquids, delivering strong adaptability to different data center cooling requirements.
• Supports a broad range of operating pressures, meeting the needs of diverse high-density data center scenarios.
• Features full traceability throughout the entire process, from supply sourcing to on-site installation.
• Undergoes strict pressure and leak testing in a controlled factory environment before leaving the facility, ensuring product reliability.

Technical features / specifications

• Application: Rack-level liquid cooling manifolds for high-density data centers.
• Functions: Regulates coolant flow rate, pressure, and temperature to ensure uniform heat dissipation and eliminate hotspots.
• Manufacturing: In-house production with precision welding and structural integrity controls.
• Testing: Rigorous pressure and leak testing; cleanliness verification to prevent contamination.
• Documentation: Full lifecycle documentation and traceability from production to on-site installation.
• Compatibility: Integrates with Hot Aisle Containment (HAC) and supports hybrid air-and-liquid deployments.
• Installation: Pre-integration options for simplified on-site deployment and global scalability.
• Fluid compatibility: Compatible with a wide variety of cooling liquids.
• Operating range: Designed to support a broad range of operating pressures for diverse data center needs.