Integrated floor-based manifold solutionsDesigned for seamless installation within EXTRCOOL hot-aisle containment systems, these floor-mounted liquid cooling manifolds are engineered for high-density data center environments. They prioritise compact footprint, precise distribution and stable thermal performance for demanding AI and HPC workloads.
Application & FunctionWith an integrated structure aligned to server racks, the manifold delivers liquid cooling directly to each cabinet position. This ensures targeted heat extraction and consistent thermal control across dense rack rows, meeting the stringent cooling requirements of modern compute clusters.
Deployment & AssemblyUnits can be customised to project-level specifications and site layouts. Factory pre-assembly of manifold subcomponents is available to simplify on-site construction, accelerate deployment schedules and reduce integration complexity for large-scale data center builds.
Installation & TestingThe plug-and-play structural design minimises installation time and on-site labor. Each manifold undergoes comprehensive factory pressure and leak testing prior to shipment. Professional on-site inspection and validation are performed after delivery to ensure long-term operational safety and performance.
Caractéristiques / spécifications techniques- Type: Floor-mounted liquid cooling manifold
- Integration: Designed for EXTRCOOL hot-aisle containment systems
- Use case: Optimised for high-density data centers (AI, HPC)
- Design: Integrated, rack-aligned distribution to each cabinet position
- Factory pre-assembly options to streamline on-site construction
- Plug-and-play structural design to reduce installation workload
- Factory pressure and leak testing for quality assurance
- On-site inspection and validation after delivery to ensure operational safety