Epoxy adhesive KB 1452 HT-2AO

for metalfor plasticsglass

Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. However, speedy cures are achievable with a straight heat cure as well at elevated temperatures. KB 1452 HT-2AO offers an extensive serviceable temperature range. It is a phenomenal adhesive that offers outstanding physical strength properties and dimensional stability. KB 1452 HT-2AO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of organic and inorganic acids, solvents, alkalis, aromatic hydrocarbons, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its high thermal conductivity and very low CTE, KB 1452 HT-2AO is widely used in medical, electronics, aerospace, optical, semiconductor and various OEM applications requiring effective heat transfer capabilities. Product Highlights Very high thermal conductivity Low coefficient of thermal expansion Castable up to 3 inches depth Outstanding chemical resistance Exceptional electrical insulation properties Very good flowability Typical Applications Bonding Sealing Coating Encapsulation Potting