Electrolytic palladium plating

high-purity

Product description
Pure palladium plating is an electroplated palladium deposit formulated for electronic components such as switch elements and connector contact parts. The deposit is non-magnetic, provides high electrical conductivity and good solderability. When plated over a nickel underlayer with palladium thickness below 0.1 μm, the coating significantly improves heat resistance, contact resistance and solderability. Palladium plating is also used as an underlayer for subsequent gold plating.

Functional property

• Abrasion & Wear Resistance
• Corrosion Resistance
• Non-Magnetic

Industry employed

• Electronics

Availability details
Mass production: yes
Process type: B, R, M, H
Under plating: Ni, st.Au
Prototype: yes
Experimental trial: yes
Regular chemical stock: yes

Process type legend
B: barrel, R: rack, M: mesh basket, H: reel to reel

Technical specifications

• Plating metal: Palladium (pure palladium deposit)
• Non-magnetic
• High electrical conductivity
• Good solderability
• Improves heat resistance, contact resistance and solderability when applied over nickel with thickness under 0.1 μm
• Used as an under layer for gold plating
• Available plating processes: Barrel, Rack, Mesh Basket, Reel to Reel
• Under plating options: Ni (nickel), st.Au (strike/under gold)
• Mass production: available
• Prototype: available
• Experimental trial: available
• Regular chemical stock: available
• Hardness: approximately Hv200