Description
This high data rate 25Gbps photodiode chip is GaAs top- illuminated PIN structure. Features is high responsibility, low capacitance, low dark current, active area size is Φ38μm, anode and cathode bond pad on top for TO-CAN package wire-bond, application in fiber channel data transmission, 25Gigabit Ethernet and Multi-mode communication etc.
Features
Φ38μm active area.
Low capacitance and low dark current.
High responsibility.
Data rate up to 25Gbps.
Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
100% testing and inspection.
Applications
25Gigabit Ethernet/Fiber channel.
25Gbps AOC (Active Optical Cable) receiver at 850nm.
25Gbps VCSEL based parallel optical interconnects.
25Gbps SFP+.
4X25Gbps QSFP.