Chamfering grinding polishing machine GC-KM202

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Product overview
The GC-KM202 is designed for multiple stages of silicon rod processing in wafer manufacturing, including squaring, chamfering, grinding and polishing. Silicon rods are loaded and clamped in a single operation. A high-precision turntable provides accurate positioning across successive stations to complete all processing steps with minimal material loss; achievable single-edge squaring margin ≤0.2 mm.

Applications

• Squaring of silicon rods
• Chamfering for improved handling and subsequent processing
• Grinding for dimensional and surface preparation
• Polishing to achieve required surface roughness

Product parameters

• Single-edge squaring margin — ≤0.2 mm
• Processing efficiency — 29 min (example: 830 mm long M10 arc bar)
• Dimensional tolerance — ±0.04 mm
• Surface roughness — Ra ≤ 0.1 μm

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• GC-GP950L Monocrystal grinding & polishing machine

Features / Technical specifications

• Model: GC-KM202
• Integrated process coverage: squaring, chamfering, grinding, polishing
• One-step loading and clamping of silicon rods
• High-precision turntable for accurate positioning across multiple stations
• Single-edge squaring margin ≤0.2 mm to minimize silicon loss
• Processing efficiency example: 29 minutes for an 830 mm long M10 arc bar
• Dimensional tolerance: ±0.04 mm
• Surface roughness: Ra ≤ 0.1 μm