Diamond wire squaring machine GC-MK202R

Product overview
The GC-MK202R is a squaring machine designed for monocrystalline silicon rod processing in wafer manufacturing. Introduced in 2022, it features independent ring-wire dual-station machining for low variation and reduced silicon loss compared with diamond-wire systems. It provides intact, chip-free edges and automated part transfer, and supports one-click switching between M10, G12 and rectangular rods. Optional half-rod cutting expands process flexibility.

Key features

• Independent ring-wire dual-station machining
• Silicon loss approximately 10% lower than diamond-wire products
• No edge chipping; complete, undamaged edges with automatic delivery
• No ribbed strip when machining G12
• One-click switch to process M10, G12 and rectangular rods
• Optional half-rod cutting for increased scalability

Technical parameters

• Model: GC-MK202R
• Launch year: 2022
• Average range of square rods (M10): ≤0.3 mm
• Circumference of ring wire: 4100 mm
• Processing efficiency (M10, length 830 mm): 28 min (2 pieces)

Applications & compatibility

• Process step: squaring during silicon wafer production
• Compatible with M10, G12 and rectangular rods
• Suitable for photovoltaic silicon rod production lines

Operation & maintenance

• One-click format switching for simple operation
• Automatic delivery reduces manual handling
• Designed for easy maintenance to facilitate operator training