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Diamond wire squaring machine GC-MK202R
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Characteristics
- Technology
- diamond wire
Description
This product is designed for square during manufacturing of silicon wafer, launched in 2022, independent circle wire dual station machining, small range, silicon loss 10% lower than that of diamond wire products; no edge chipping, complete edge without damage, automatic delivery. There is no ribbed strip when machining G12 products; switch via one click to machine M10, G12 and rectangle rods, easy operation, convenient maintenance, and the user can get to know how to operate the equipment quickly; optional cutting of half rods, high scalability.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.