Passive infrared sensor OHLE3123

uncooled

Overview
The OHLE3123 is a super-wafer-level-packaged (SWLP) long-wave infrared (LWIR) uncooled microbolometer sensor (384×288, 12µm). Its SWLP window design and SMT compatibility simplify integration and support rapid mass production, enabling ultra-compact, lightweight thermal imaging modules for OEM and embedded applications.

Key features

• Resolution: 384×288
• Pixel pitch: 12µm
• Spectral range: 8–14µm
• Frame rate: ≤60 Hz
• Power consumption (25 Hz, 300 K): <65 mW
• Dimensions: 10.4 mm × 10.4 mm × 4.3 mm
• Package weight: <0.6 g
• Operability rate: ≥99.5%

Technical specifications

• Sensor technology: Vanadium oxide (VOx) microbolometer
• Resolution: 384×288
• Spectral range: 8–14µm
• Pixel pitch: 12µm
• NETD (f/1.0, 25 Hz, 300 K): <40 mK
• Frame rate: ≤60 Hz
• Thermal time constant: <15 ms
• Digital output: 14 bits
• Readout mode: Rolling shutter
• Mirroring: X and Y
• Non-uniformity correction: Onboard correction
• Power consumption (25 Hz, 300 K): <65 mW
• Dimensions: 10.4 × 10.4 × 4.3 mm
• Package: 36-pin SWLP
• Package weight: <0.6 g
• Temperature measurement range: -40 °C to 600 °C
• Output polarity: Black hot
• Operability rate: ≥99.5%
• Input interfaces: I2C (MODE0); 2-bit parallel (MODE1)
• Operating temperature range: -40 °C to +85 °C

Applications

• Outdoor night vision and personnel search & rescue
• Security and perimeter monitoring
• Industrial temperature measurement and thermography
• Embedded thermal imaging modules and other compact integration scenarios

Integration & interfaces
Designed for SMT assembly and high-volume manufacturing. Standard digital outputs and control interfaces simplify integration into thermal cameras, inspection systems and safety equipment.

• Mounting: SMT-compatible SWLP package
• Interface modes: I2C (MODE0) or 2-bit parallel (MODE1)
• Recommended uses: embedded modules, handheld devices, security cameras