DescriptionLCM160 is a long-wave infrared (8–14 μm, LWIR) uncooled thermal imaging module that converts an object's thermal radiation into a digital output. The module comprises a detector, shutter, lens and structural components; the host performs the necessary ISP algorithm processing. Its compact size, low weight and low power consumption make it suitable for security monitoring, thermal measurement instruments, smart appliances and industrial systems.
Features- Resolution: 160×120
- Pixel pitch: 12 μm
- Effective frame rate: ≤25 Hz
- Typical power consumption: Normal mode 45 mW (typical); Shutter active 750 mW (typical)
- Package dimensions (W×L×H): 17.9 mm × 16.8 mm × 9.9 mm (per drawing)
Applications / Industry Solutions- Fire detection and monitoring
- Security surveillance
- Industrial thermal inspection and process monitoring
Specifications / Technical data- Model: LCM160
- Detector type: Vanadium oxide uncooled infrared focal plane detector
- IR wavelength: 8–14 μm
- Resolution: 160×120
- Pixel pitch: 12 μm
- Noise equivalent temperature difference (NETD): <50 mK @25°C, F#1.0, 25 Hz
- Thermal time constant: <10 ms
- Effective frame rate: ≤25 Hz
- Non-uniformity correction: On-chip 4-bit non-uniformity correction and shutter correction supported
- Image output formats: Standard parallel port, line-by-line output, black-hot, Raw 14-bit
- Focusing mode: Fixed focus, athermalized
- Temperature measurement — Range: -20°C to 150°C (high-accuracy), 0°C to 550°C (wide-range)
- Temperature measurement — Accuracy: ±2°C or ±2% (typical)
- Input supply voltage: 5 V (analog), 1.8 V (digital)
- Image data interface: 8-bit standard parallel port
- Control interface: I2C
- Typical power consumption: Normal mode 45 mW (typical); Shutter active 750 mW (typical)
- Physical characteristics (module, lens and flange not included) — Package dimensions (W×L×H): 17.9 mm × 16.8 mm × 9.9 mm (per drawing)
- Weight: –
- Operating temperature: -20°C to 60°C
- Storage temperature: -45°C to 85°C
- Shock: 25 g, 11 ms, half-sine, 3 axes