encapsulatedlocal area network (LAN)for printed circuit boards
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Characteristics
Type
power
Configuration
encapsulated
Applications
local area network (LAN)
Mounting
for printed circuit boards
Description
Economical
Low leakage inductance and interwinding capacitance
Fast rise time: 3nSec typical
Low profile 16-pin DIP (14-pin available)
Surface mount design available
Choice of turns ratio, 1:1 or 2:1
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.