Heat cycle test system SMG2-600-CB-W

functional safetyagingperformance

SANWOOD Memory Burn-in Test System

Integrated Burn-in and Functional Testing for Memory ICs

The SANWOOD Memory Burn-in Test System combines controlled thermal conditions, electrical stress and memory functional testing in a configurable platform. Designed around Burn-in Boards (BIBs), it supports parallel device screening and reliability evaluation, with the system configuration matched to the customer’s memory products and testing process.

Chamber dimensions, device capacity, board arrangement and heat-load capability can be customized according to package size, BIB design, operating power and production requirements.

Integrated Burn-in and Memory Testing

Coordinate temperature exposure, electrical excitation and functional test sequences within one testing workflow. For DRAM and LPDDR applications, the configuration can incorporate burn-in and core testing to streamline the transition between stress screening and device evaluation.

Electrical test conditions, device connections and test programs are matched to the selected memory family and test objectives.

Parallel Testing with Configurable Device Capacity

The BIB-based arrangement accommodates multiple devices across multiple boards. Capacity is defined by the device package, socket layout, BIB dimensions, available board positions and operating heat load.

SANWOOD can configure the chamber size and loading arrangement around the required sample quantity and throughput, helping customers plan equipment capacity as their testing needs develop.

Thermal Control for Powered Memory Loads

Temperature distribution is an important consideration when populated memory boards operate under electrical stress. The thermal design accounts for board density, airflow paths and device heat dissipation.

Separate uniformity specifications for powered and unpowered BIB loads provide a clearer basis for evaluating performance under the intended test conditions.

Sample Temperature Stabilization

The system specification includes sample surface stabilization time after the chamber control sensor reaches its setpoint. This helps engineers establish the timing of electrical measurements and thermal exposure periods.

The temperature reference and stabilization criterion are defined in the test procedure according to the device and applicable test method.

Customization Around Your Memory Products

Chamber Dimensions and Volume

Internal width, height, depth and chamber volume can be customized to accommodate the customer’s BIB dimensions, board arrangement and installation space.

Sample Quantity and BIB Capacity

Board positions, devices per board and total sample capacity can be configured according to package dimensions, socket spacing, connection requirements and target throughput.

Heat-Load Capability

Thermal capacity can be designed around the actual power dissipation of the loaded devices and boards at the required operating temperatures.

Board Layout and Test Connections

Rack arrangement, board spacing and interfaces can be configured around the BIB design and electrical test architecture.

Test Requirements

Temperature profiles, electrical stress conditions, test sequences and data requirements form part of the project specification.

Representative Configuration — SMG2-600-CB-W

The following specifications describe a reference configuration. Chamber dimensions, sample capacity and heat-load capability can be customized for the customer’s products.

Model and Capacity

Model: SMG2-600-CB-W

Test Area Capacity: 600 L × 2 (Customizable according to sample dimensions and test rack).

Internal Dimensions, W × H × D: 600 × 1320 × 730 mm

Overall Dimensions, W × H × D: 4000 × 2500 × 2200 mm

Temperature Control

Temperature Range: −10°C to +150°C

Temperature Fluctuation: ±0.5°C at steady state with a full, unpowered BIB load.

Temperature Deviation: ±2°C, based on the average temperature deviation at each individual sensor.

Temperature Uniformity Under Load

Full, Unpowered BIB Load: Within ±1.5°C at steady state.

Full, Powered BIB Load: Within ±3.0°C at steady state.

Applicable range for both uniformity specifications: −10°C to +130°C.

Heating Performance

+25°C to +100°C: ≤30 minutes.

+100°C to +125°C: ≤20 minutes.

−10°C to +100°C: ≤40 minutes.

Specified with the test rack fully loaded and the BIBs unpowered.

Cooling Performance

+125°C to +100°C: ≤15 minutes.

+100°C to −10°C: ≤40 minutes.

+100°C to +25°C: ≤30 minutes.

Specified with the test rack fully loaded and the BIBs unpowered.

Sample Surface Temperature Stabilization

Within 12 minutes after the chamber control sensor reaches the setpoint, under the specified BIB loading and power conditions.

Electrical Requirements

Power Supply: AC 380 V, 50 Hz

Approximate Maximum Operating Power: 2 × 56 kW

Noise Level

≤72 dB(A), measured 1.5 m from the equipment under the specified operating conditions.

Final dimensions, device capacity, heat-load rating, electrical requirements and loaded performance are defined in the project specification.

Memory Testing Applications

Applications include memory IC burn-in screening, functional evaluation, operating-life studies and production reliability testing.

Device-specific configurations can be developed for DRAM, LPDDR, NAND Flash, NOR Flash, eMMC and memory controllers. HBM projects are reviewed according to package interfaces, board architecture and electrical test requirements.

Relevant International Test Standards

Test plans may reference the following standards according to the memory technology and qualification objective.

JEDEC JESD22-A108 — Temperature, Bias, and Operating Life

Operating-life evaluation under defined temperature and electrical stress, including High-Temperature Operating Life (HTOL) testing.

JEDEC JESD22-A103 — High-Temperature Storage Life

Elevated-temperature storage evaluation of semiconductor devices without operating bias.

JEDEC JESD22-A117 — Nonvolatile Memory Endurance and Data Retention

Endurance and retention evaluation using appropriate program/erase, readback and thermal exposure procedures.

MIL-STD-883, Method 1015 — Burn-in Test

Microcircuit screening intended to reveal early-life, time-dependent and stress-dependent failures.

AEC-Q100 — Automotive Integrated Circuit Qualification

Qualification planning for automotive memory ICs, including applicable operating-life tests within the complete device qualification program.

The selected standard revision, stress conditions, temperature reference, duration and acceptance criteria are agreed during project definition. Qualification suitability is validated with the complete thermal and electrical test arrangement under representative loading.

About SANWOOD

Founded in 1995, SANWOOD manufactures environmental and reliability testing equipment for semiconductor, electronics, automotive and aerospace applications. Its portfolio includes memory burn-in systems, temperature forcing systems, HAST chambers, HALT/HASS chambers and thermal shock chambers.

Request a Customized Memory Burn-in Solution

Share your memory device specifications, BIB drawings, required sample quantity, operating heat load and test procedure with SANWOOD.

Our team can develop a configuration proposal covering chamber dimensions, board capacity, thermal performance and test integration requirements for your application.SANWOOD Memory Burn-in Test System

Integrated Burn-in and Functional Testing for Memory ICs

The SANWOOD Memory Burn-in Test System combines controlled thermal conditions, electrical stress and memory functional testing in a configurable platform. Designed around Burn-in Boards (BIBs), it supports parallel device screening and reliability evaluation, with the system configuration matched to the customer’s memory products and testing process.

Chamber dimensions, device capacity, board arrangement and heat-load capability can be customized according to package size, BIB design, operating power and production requirements.

Integrated Burn-in and Memory Testing

Coordinate temperature exposure, electrical excitation and functional test sequences within one testing workflow. For DRAM and LPDDR applications, the configuration can incorporate burn-in and core testing to streamline the transition between stress screening and device evaluation.

Electrical test conditions, device connections and test programs are matched to the selected memory family and test objectives.

Parallel Testing with Configurable Device Capacity

The BIB-based arrangement accommodates multiple devices across multiple boards. Capacity is defined by the device package, socket layout, BIB dimensions, available board positions and operating heat load.

SANWOOD can configure the chamber size and loading arrangement around the required sample quantity and throughput, helping customers plan equipment capacity as their testing needs develop.

Thermal Control for Powered Memory Loads

Temperature distribution is an important consideration when populated memory boards operate under electrical stress. The thermal design accounts for board density, airflow paths and device heat dissipation.

Separate uniformity specifications for powered and unpowered BIB loads provide a clearer basis for evaluating performance under the intended test conditions.

Sample Temperature Stabilization

The system specification includes sample surface stabilization time after the chamber control sensor reaches its setpoint. This helps engineers establish the timing of electrical measurements and thermal exposure periods.

The temperature reference and stabilization criterion are defined in the test procedure according to the device and applicable test method.

Customization Around Your Memory Products

Chamber Dimensions and Volume

Internal width, height, depth and chamber volume can be customized to accommodate the customer’s BIB dimensions, board arrangement and installation space.

Sample Quantity and BIB Capacity

Board positions, devices per board and total sample capacity can be configured according to package dimensions, socket spacing, connection requirements and target throughput.

Heat-Load Capability

Thermal capacity can be designed around the actual power dissipation of the loaded devices and boards at the required operating temperatures.

Board Layout and Test Connections

Rack arrangement, board spacing and interfaces can be configured around the BIB design and electrical test architecture.

Test Requirements

Temperature profiles, electrical stress conditions, test sequences and data requirements form part of the project specification.

Representative Configuration — SMG2-600-CB-W

The following specifications describe a reference configuration. Chamber dimensions, sample capacity and heat-load capability can be customized for the customer’s products.

Model and Capacity

Model: SMG2-600-CB-W

Test Area Capacity: 600 L × 2

Internal Dimensions, W × H × D: 600 × 1320 × 730 mm

Overall Dimensions, W × H × D: 4000 × 2500 × 2200 mm

Temperature Control

Temperature Range: −10°C to +150°C

Temperature Fluctuation: ±0.5°C at steady state with a full, unpowered BIB load.

Temperature Deviation: ±2°C, based on the average temperature deviation at each individual sensor.

Temperature Uniformity Under Load

Full, Unpowered BIB Load: Within ±1.5°C at steady state.

Full, Powered BIB Load: Within ±3.0°C at steady state.

Applicable range for both uniformity specifications: −10°C to +130°C.

Heating Performance

+25°C to +100°C: ≤30 minutes.

+100°C to +125°C: ≤20 minutes.

−10°C to +100°C: ≤40 minutes.

Specified with the test rack fully loaded and the BIBs unpowered.

Cooling Performance

+125°C to +100°C: ≤15 minutes.

+100°C to −10°C: ≤40 minutes.

+100°C to +25°C: ≤30 minutes.

Specified with the test rack fully loaded and the BIBs unpowered.

Sample Surface Temperature Stabilization

Within 12 minutes after the chamber control sensor reaches the setpoint, under the specified BIB loading and power conditions.

Electrical Requirements

Power Supply: AC 380 V, 50 Hz

Approximate Maximum Operating Power: 2 × 56 kW

Noise Level

≤72 dB(A), measured 1.5 m from the equipment under the specified operating conditions.

Final dimensions, device capacity, heat-load rating, electrical requirements and loaded performance are defined in the project specification.

Memory Testing Applications

Applications include memory IC burn-in screening, functional evaluation, operating-life studies and production reliability testing.

Device-specific configurations can be developed for DRAM, LPDDR, NAND Flash, NOR Flash, eMMC and memory controllers. HBM projects are reviewed according to package interfaces, board architecture and electrical test requirements.

Relevant International Test Standards

Test plans may reference the following standards according to the memory technology and qualification objective.

JEDEC JESD22-A108 — Temperature, Bias, and Operating Life

Operating-life evaluation under defined temperature and electrical stress, including High-Temperature Operating Life (HTOL) testing.

JEDEC JESD22-A103 — High-Temperature Storage Life

Elevated-temperature storage evaluation of semiconductor devices without operating bias.

JEDEC JESD22-A117 — Nonvolatile Memory Endurance and Data Retention

Endurance and retention evaluation using appropriate program/erase, readback and thermal exposure procedures.

MIL-STD-883, Method 1015 — Burn-in Test

Microcircuit screening intended to reveal early-life, time-dependent and stress-dependent failures.

AEC-Q100 — Automotive Integrated Circuit Qualification

Qualification planning for automotive memory ICs, including applicable operating-life tests within the complete device qualification program.

The selected standard revision, stress conditions, temperature reference, duration and acceptance criteria are agreed during project definition. Qualification suitability is validated with the complete thermal and electrical test arrangement under representative loading.

About SANWOOD

Founded in 1995, SANWOOD manufactures environmental and reliability testing equipment for semiconductor, electronics, automotive and aerospace applications. Its portfolio includes memory burn-in systems, temperature forcing systems, HAST chambers, HALT/HASS chambers and thermal shock chambers.

Request a Customized Memory Burn-in Solution

Share your memory device specifications, BIB drawings, required sample quantity, operating heat load and test procedure with SANWOOD.

Our team can develop a configuration proposal covering chamber dimensions, board capacity, thermal performance and test integration requirements for your application.SANWOOD Memory Burn-in Test System

Integrated Burn-in and Functional Testing for Memory ICs

The SANWOOD Memory Burn-in Test System combines controlled thermal conditions, electrical stress and memory functional testing in a configurable platform. Designed around Burn-in Boards (BIBs), it supports parallel device screening and reliability evaluation, with the system configuration matched to the customer’s memory products and testing process.

Chamber dimensions, device capacity, board arrangement and heat-load capability can be customized according to package size, BIB design, operating power and production requirements.

Integrated Burn-in and Memory Testing

Coordinate temperature exposure, electrical excitation and functional test sequences within one testing workflow. For DRAM and LPDDR applications, the configuration can incorporate burn-in and core testing to streamline the transition between stress screening and device evaluation.

Electrical test conditions, device connections and test programs are matched to the selected memory family and test objectives.

Parallel Testing with Configurable Device Capacity

The BIB-based arrangement accommodates multiple devices across multiple boards. Capacity is defined by the device package, socket layout, BIB dimensions, available board positions and operating heat load.

SANWOOD can configure the chamber size and loading arrangement around the required sample quantity and throughput, helping customers plan equipment capacity as their testing needs develop.

Thermal Control for Powered Memory Loads

Temperature distribution is an important consideration when populated memory boards operate under electrical stress. The thermal design accounts for board density, airflow paths and device heat dissipation.

Separate uniformity specifications for powered and unpowered BIB loads provide a clearer basis for evaluating performance under the intended test conditions.

Sample Temperature Stabilization

The system specification includes sample surface stabilization time after the chamber control sensor reaches its setpoint. This helps engineers establish the timing of electrical measurements and thermal exposure periods.

The temperature reference and stabilization criterion are defined in the test procedure according to the device and applicable test method.

Customization Around Your Memory Products

Chamber Dimensions and Volume

Internal width, height, depth and chamber volume can be customized to accommodate the customer’s BIB dimensions, board arrangement and installation space.

Sample Quantity and BIB Capacity

Board positions, devices per board and total sample capacity can be configured according to package dimensions, socket spacing, connection requirements and target throughput.

Heat-Load Capability

Thermal capacity can be designed around the actual power dissipation of the loaded devices and boards at the required operating temperatures.

Board Layout and Test Connections

Rack arrangement, board spacing and interfaces can be configured around the BIB design and electrical test architecture.

Test Requirements

Temperature profiles, electrical stress conditions, test sequences and data requirements form part of the project specification.

Representative Configuration — SMG2-600-CB-W

The following specifications describe a reference configuration. Chamber dimensions, sample capacity and heat-load capability can be customized for the customer’s products.

Model and Capacity

Model: SMG2-600-CB-W

Test Area Capacity: 600 L × 2

Internal Dimensions, W × H × D: 600 × 1320 × 730 mm

Overall Dimensions, W × H × D: 4000 × 2500 × 2200 mm

Temperature Control

Temperature Range: −10°C to +150°C

Temperature Fluctuation: ±0.5°C at steady state with a full, unpowered BIB load.

Temperature Deviation: ±2°C, based on the average temperature deviation at each individual sensor.

Temperature Uniformity Under Load

Full, Unpowered BIB Load: Within ±1.5°C at steady state.

Full, Powered BIB Load: Within ±3.0°C at steady state.

Applicable range for both uniformity specifications: −10°C to +130°C.

Heating Performance

+25°C to +100°C: ≤30 minutes.

+100°C to +125°C: ≤20 minutes.

−10°C to +100°C: ≤40 minutes.

Specified with the test rack fully loaded and the BIBs unpowered.

Cooling Performance

+125°C to +100°C: ≤15 minutes.

+100°C to −10°C: ≤40 minutes.

+100°C to +25°C: ≤30 minutes.

Specified with the test rack fully loaded and the BIBs unpowered.

Sample Surface Temperature Stabilization

Within 12 minutes after the chamber control sensor reaches the setpoint, under the specified BIB loading and power conditions.

Electrical Requirements

Power Supply: AC 380 V, 50 Hz

Approximate Maximum Operating Power: 2 × 56 kW

Noise Level

≤72 dB(A), measured 1.5 m from the equipment under the specified operating conditions.

Final dimensions, device capacity, heat-load rating, electrical requirements and loaded performance are defined in the project specification.

Memory Testing Applications

Applications include memory IC burn-in screening, functional evaluation, operating-life studies and production reliability testing.

Device-specific configurations can be developed for DRAM, LPDDR, NAND Flash, NOR Flash, eMMC and memory controllers. HBM projects are reviewed according to package interfaces, board architecture and electrical test requirements.

Relevant International Test Standards

Test plans may reference the following standards according to the memory technology and qualification objective.

JEDEC JESD22-A108 — Temperature, Bias, and Operating Life

Operating-life evaluation under defined temperature and electrical stress, including High-Temperature Operating Life (HTOL) testing.

JEDEC JESD22-A103 — High-Temperature Storage Life

Elevated-temperature storage evaluation of semiconductor devices without operating bias.

JEDEC JESD22-A117 — Nonvolatile Memory Endurance and Data Retention

Endurance and retention evaluation using appropriate program/erase, readback and thermal exposure procedures.

MIL-STD-883, Method 1015 — Burn-in Test

Microcircuit screening intended to reveal early-life, time-dependent and stress-dependent failures.

AEC-Q100 — Automotive Integrated Circuit Qualification

Qualification planning for automotive memory ICs, including applicable operating-life tests within the complete device qualification program.

The selected standard revision, stress conditions, temperature reference, duration and acceptance criteria are agreed during project definition. Qualification suitability is validated with the complete thermal and electrical test arrangement under representative loading.

About SANWOOD

Founded in 1995, SANWOOD manufactures environmental and reliability testing equipment for semiconductor, electronics, automotive and aerospace applications. Its portfolio includes memory burn-in systems, temperature forcing systems, HAST chambers, HALT/HASS chambers and thermal shock chambers.

Request a Customized Memory Burn-in Solution

Share your memory device specifications, BIB drawings, required sample quantity, operating heat load and test procedure with SANWOOD.

Our team can develop a configuration proposal covering chamber dimensions, board capacity, thermal performance and test integration requirements for your application.